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Content available
Article
Publication date: 3 August 2010

57

Abstract

Details

Assembly Automation, vol. 30 no. 3
Type: Research Article
ISSN: 0144-5154

Content available
Article
Publication date: 13 February 2007

Pete Starkey and Martin Goosey

267

Abstract

Details

Circuit World, vol. 33 no. 1
Type: Research Article
ISSN: 0305-6120

Content available
Book part
Publication date: 10 May 2023

Abstract

Details

Contemporary Studies of Risks in Emerging Technology, Part A
Type: Book
ISBN: 978-1-80455-563-7

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Article
Publication date: 2 August 2011

1037

Abstract

Details

Microelectronics International, vol. 28 no. 3
Type: Research Article
ISSN: 1356-5362

Content available
Article
Publication date: 14 September 2012

Martin Goosey

268

Abstract

Details

Soldering & Surface Mount Technology, vol. 24 no. 4
Type: Research Article
ISSN: 0954-0911

Content available

Abstract

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Microelectronics International, vol. 16 no. 1
Type: Research Article
ISSN: 1356-5362

Content available
Article
Publication date: 20 November 2009

J.H. Ling

882

Abstract

Details

Circuit World, vol. 35 no. 4
Type: Research Article
ISSN: 0305-6120

Content available
Article
Publication date: 1 March 2003

Clive Loughlin

205

Abstract

Details

Sensor Review, vol. 23 no. 1
Type: Research Article
ISSN: 0260-2288

Content available
Article
Publication date: 27 March 2009

60

Abstract

Details

Sensor Review, vol. 29 no. 2
Type: Research Article
ISSN: 0260-2288

Open Access
Article
Publication date: 2 April 2020

Witold Nawrot and Karol Malecha

The purpose of this paper is to review possibilities of implementing ceramic additive manufacturing (AM) into electronic device production, which can enable great new…

1634

Abstract

Purpose

The purpose of this paper is to review possibilities of implementing ceramic additive manufacturing (AM) into electronic device production, which can enable great new possibilities.

Design/methodology/approach

A short introduction into additive techniques is included, as well as primary characterization of structuring capabilities, dielectric performance and applicability in the electronic manufacturing process.

Findings

Ceramic stereolithography (SLA) is suitable for microchannel manufacturing, even using a relatively inexpensive system. This method is suitable for implementation into the electronic manufacturing process; however, a search for better materials is desired, especially for improved dielectric parameters, lowered sintering temperature and decreased porosity.

Practical implications

Relatively inexpensive ceramic SLA, which is now available, could make ceramic electronics, currently restricted to specific applications, more available.

Originality/value

Ceramic AM is in the beginning phase of implementation in electronic technology, and only a few reports are currently available, the most significant of which is mentioned in this paper.

Details

Microelectronics International, vol. 37 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

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