Patent abstracts

Citation

(2010), "Patent abstracts", Assembly Automation, Vol. 30 No. 3. https://doi.org/10.1108/aa.2010.03330cad.005

Patent abstracts

Article Type: Web sites, patent abstracts and book review From: Assembly Automation, Volume 30, Issue 3

Title: Assembly of nano-particles using DNA-mediated charge trapping

Patent number: US2009053425 (A1)

Publication date: February 26, 2009

Applicant: Academia Sinica (TW)

Abstract

A method for producing single-dimensioned gold-nano-particle patterns having a single-particle resolution in which the line-width is only limited by the particle size. Initially, a focused electron beam is used to generate a positive charge layer on an SiO₂ surface. Biotinated DNA molecules attracted by these positive charges are then used to acquire Au-nano-particles revealing the e-beam exposure patterns. The particles in the single-line patterns become separated in an orderly manner, due to the repulsive force between different Au colloidal particles. Each single-line pattern has potential use in nano-photonics and nano-electronics. In nano-electronics, the line patterns serve as a template for high or low-resistance conductive nano-wires. Low-resistance wires exhibit linear current-voltage characteristics with an extremely high maximum allowed current density. The high-resistance wires display charging effect with clear Coulomb oscillation behavior at low temperatures. The method of the invention can produce interconnects as well as single-electron-transistors. In addition, the method permits flexibility and opens up possibilities for fabrication of integrated circuits.

Title: Universal interface for a micro-fluidic chip

Patent number: US2009283408 (A1)

Publication date: November 19, 2009

Applicant: Octrolix BV (NL)

Abstract

An integrated capillary electrophoresis system comprising a universal interface is disclosed. The universal interface includes one or more of the following structural elements: a chip assembly that receives a capillary electrophoresis CE chip; a fluidic interface for coupling fluids between the chip assembly and external sources or destinations; a first electrical interface for coupling power from an external source to the chip assembly; a second electrical interface for coupling electrical signals from the chip assembly to external analysis electronics; an optical interface for coupling optical signals between the chip assembly and external sources or destinations; and a docking station for uniting and spatially locating the various other structural elements.

Title: Methods for the synthesis of modular poly (Phenyleneethynylenes) and fine tuning the electronic properties thereof for the functionalization of nanomaterials

Patent number: US2009203867 (A1)

Publication date: August 13, 2009

Applicant: Zyvex Performance Materials In (USA)+

Abstract

Poly (aryleneethynylene) polymers for exfoliating and dispersing/solubilizing nanomaterial are provided herein. The poly (aryleneethynylene) polymers have unit monomer portions, each monomer portion having at least one electron donating substituent thereby forming an electron donor monomer portion, or at least one electron withdrawing substituent thereby forming an electron accepting monomer portion. Such polymers exfoliate and disperse nanomaterial without presonication of the nanomaterial.

Title: Bottom-up assembly of structures on a substrate

Patent number: WO2009108404 (A2)

Publication date: September 3, 2009

Applicant: Penn State Res Found (USA); Mayer Theresa S. (USA); Keating Christine D. (USA); Li Mingwei (USA); Morrow Thomas (USA); Kim Jaekyun (USA)

Abstract

Examples of the present invention include methods of assembling structures, such as nanostructures, at predetermined locations on a substrate. A voltage between spaced-apart electrodes supported by substrate attracts the structures to the substrate, and positional registration can be provided the substrate using topographic features such as wells. Examples of the present invention also include devices, such as electronic and optoelectronic devices, prepared by such methods.

Title: Glass micro-nano-fluidic control chip, preparation and assembly method and auxiliary assembly device thereof

Patent number: CN101561446 (A)

Publication date: October 21, 2009

Applicant: Univ. Dalian Tech (CN)

Abstract

The invention discloses a glass micro-nano-fluidic control chip, a preparation and assembly method and an auxiliary assembly device thereof. The chip comprises one or more micro-nano-enriched units; each micro-nano-enriched unit consists of two non-crossed micro-passages, a nana-passage array and a liquid storage pool; the micro-passage and the liquid storage pool are arranged on a cover sheet; the nano-passage array is distributed on a substrate; and the two micro-passages are bridged to each other by the nano-passage array with a method of assembling the substrate and the cover sheet. The assembly process comprises three steps of aligning, pre-connecting and bonding; an auxiliary aligning device is used for aligning and bridging the micro-nano passage; the pre-connection of the substrate and the cover sheet with a certain strength is realized by the interaction of a water film and a glass surface; and the micro-nano-fluidic control chip is encapsulated by the hot bonding process. The invention provides a high flux micro-nano-fluidic control chip containing various groups of enriching structures of variable parameters and a manufacturing and assembly method, and improves the interchanging performance of the chip parts. The chip is simple to be manufactured, needs no secondary aligning, carving and corroding, reduces the process complexity and realizes the objects of low cost and batch production.

Title: Micro temperature different electric device assembly system and method based on thin-film temperature different electric material

Patent number: CN101420011 (A)

Publication date: April 29, 2009

Applicant: Univ. Tianjin (CN)

Abstract

The invention relates to a micro thermoelectric device assembly system based on thin-film thermoelectric material and a method thereof. The system essentially comprises a CNC transverse device, an aligning device, a micro thermoelectric device fixing device, a system supporting frame and a power supply. The CNC transverse device is used for realizing the precise horizontal displacement of a thermoelectric thin-film to be assembled, the aligning device is used for realizing the precise positioning of micro thermoelectric device and the thermoelectric thin-film to be assembled, the micro thermoelectric device fixing device is used for fixing the micro thermoelectric device and moving the micro thermoelectric device up and down, the system supporting frame is used for fixing the aligning device, the NC transverse device and the micro thermoelectric device fixing device and achieving the three-dimensional space arrangement of aligning device, the NC transverse device and the micro thermoelectric device fixing device, and the power supply provides electrical energy for the aligning device and the micro thermoelectric device fixing device. The newly structured micro thermoelectric device assembly system based on thin-film thermoelectric material cannot only ensure high precision in the manufacturing process, but also can significantly improve the manufacturing efficiency of thermoelectric devices.

Title: Method to assemble structures from nano-materials

Patent number: US2009278257 (A1)

Publication date: November 12, 2009

Applicant: Intel Corporation

Abstract

Numerous embodiments of a method to assemble nano-materials on a platform are described. In one embodiment, a nano-material is functionalized with a first bondable group. The functionalized nano-material is disposed on an assembly platform having an electrode to form a first layer. Additional layers of the nano-material may be formed above the first layer to form a semiconductor device. In one embodiment, the nano-material may be a carbon nanotube.