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This paper aims to present the main factors affecting the mechanical drilling of the printed circuit board (PCB for short) micro-holes and method of micro-ultrasonic powder molding (micro-UPM for short) by utilizing PCB micro-hole array.

To optimize the drilling process, the paper proposes the on-line monitoring methods for the drilling process including drilling force, drilling temperature, high-speed photography and vibration signals. Taking 0.10 and 0.15 mm micro-drilling as examples, the paper analyzes the drilling process of ultra-small micro-holes. Finally, by taking the PCBs with 0.10 and 0.15 mm micro-hole arrays as the micro-cavity inserts, utilizing ultra-high-molecule weight polyethylene powder with the average particle size of about 150 μm as raw material, two sizes of micro-cylinder array polymer parts are fabricated through micro-UPM process.

PCB micro-cavity inserts with micro-hole arrays fabricated by mechanical drilling has the advantages of low costs, high efficiency and good consistency. Taking 0.10 and 0.15 mm micro-drilling as examples, it is found that the both measured apertures are about 10.0 μm more than the diameter of the micro-drill bits on average. The average diameter of the micro-cylinders by micro-UPM process is smaller than that of the micro-hole with the same specification, while the value of the roughness of the cylinder surface is more than that of the hole-wall surface with the same specification.

This paper describes the challenges and the developments of mechanical drilling and by using PCB micro-cavity inserts with micro-hole arrays fabricated by mechanical drilling, two different micro-cylinder array polymer parts are successfully made and thus the application area of PCB micro-drilling is broadened.