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The driving forces behind recent significant improvements in organic packages for microelectronic applications are electrical performance, product weight, size and manufacturing cost. A very careful selection of optimum manufacturing processes, equipment and materials, and stringent control of critical manufacturing operations are prerequisites for success in this emerging market place. Major technical and business related challenges to a printed circuit board manufacturer who plans to enter this market are discussed.

Stepping off the British Airways flight from Heathrow into the midday sun of Bologna, Italy, it is amazing the difference in temperature two short hours can make. A brief bus trip, train journey and taxi cab later and we arrive at the hotel housing the delegates for the two‐day meeting. The conference/exhibition centre is less than two kilometres away. A pleasant walk in dry weather, but the following two days preceded some of the wettest weather in Europe, with four inches of rainfall in one day. Our location is Modena in northern Italy, heartland of some of the richest cuisine in the country.

‘Soldering and Cleaning in Electronics’ international conference, including an exposition, took place in Brno on 12–13 October 1993. The conference was organised by SMT‐Info, together with the ISHM‐Czech and Slovak Chapter. The purpose of this common action was to bring together the professionals in surface mount technology and thick film technology. In the framework of the conference, in which 130 home and foreign delegates participated, the annual meeting of the ISHM‐Czech and Slovak Chapter took place.