Organic Microelectronic Packages: Challenges for a PCB Manufacturer

Abstract

The driving forces behind recent significant improvements in organic packages for microelectronic applications are electrical performance, product weight, size and manufacturing cost. A very careful selection of optimum manufacturing processes, equipment and materials, and stringent control of critical manufacturing operations are prerequisites for success in this emerging market place. Major technical and business related challenges to a printed circuit board manufacturer who plans to enter this market are discussed.

Citation

zur Nieden, T. (1994), "Organic Microelectronic Packages: Challenges for a PCB Manufacturer", Circuit World, Vol. 21 No. 1, pp. 18-27. https://doi.org/10.1108/eb046284