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The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties (>5 MPa shear strength) and low thermal interface resistance (better than for SAC solders) are the goal of this research.

Mechanical and thermal properties of TIM joints between gold plated contacts of chip and substrate were investigated. Sintering technique based on Ag pastes was applied for purpose of this study. Performance properties were assessed by shear force tests and thermal measurements. Scanning electron microscopy was used for microstructural observations of cross-section of formed joints.

It was concluded that the best properties are achieved for pastes containing spherical Ag particles of dozens of micrometer size with flake shaped Ag particles of few micrometers size. Sintering temperature at 230°C and application of 1 MPa force on the chip during sintering gave the higher adhesion and the lowest thermal interface resistance.

The new material based on Ag paste containing mixtures of Ag particles of different size (form nanometer to dozens of microns) and shape (spherical, flake) suspended in resin was proposed. Joints prepared using sintering technique and Ag pastes at 230°C with applied pressure shows better mechanical and thermal than other TIM materials such as thermal grease, thermal gel or thermally conductive adhesive. Those material could enable electronic device operation at temperatures above 200°C, currently unavailable for Si-based power electronics.

The purpose of this study is to analyze the nonhomogeneous model on the mixed convection of Al2O3–Fe3O4 Bingham plastic hybrid nanofluid in a ventilated enclosure subject to an externally imposed uniform magnetic field. Entropy generation and the pressure drop are determined to analyze the performance of the heat transfer. The significance of Joule heating arising due to the applied magnetic field on the heat transfer of the yield stress fluid is described.

The ventilation in the enclosure of heated walls is created by an opening on one vertical wall through which cold fluid is injected and another opening on the opposite vertical wall through which fluid can flow out.

This study finds that the inclusion of Fe₃O₄ nanoparticles with the Al₂O₃-viscoplastic nanofluid augments the heat transfer. This rate of enhancement in heat transfer is higher than the rate by which the entropy generation is increased as well as the enhancement in the pressure drop. The yield stress has an adverse effect on the heat transfer; however, it favors thermal mixing. The magnetic field, which is acting opposite to the direction of the inlet jet, manifests heat transfer of the viscoplastic hybrid nanofluid. The horizontal jet of cold fluid produces the optimal heat transfer.

The objective of this study is to analyze the impact of the inclined cold jet of viscoplastic electrically conducting hybrid nanofluid on heat transfer from the enclosure in the presence of a uniform magnetic field. The combined effect of hybrid nanoparticles and a magnetic field to enhance heat transfer of a viscoplastic fluid in a ventilated enclosure has not been addressed before.