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In this paper, we evaluated the impact of the US “Chip Act” on the participation of the Chinese electronics industry in the global value chain based on the dynamic CGE model. This is a meaningful attempt to use the GTAP-VA model to analyze the electronics industry in China.

We employ a Dynamic GTAP-VA Model to quantitatively evaluate the economic repercussions of the “Chip Act” on the Chinese electronic industries' GVC participation from 2023 to 2040.

The findings depict a discernible contraction in China’s electronic sector by 2040, marked by a −2.95% change in output, a −3.50% alteration in exports and a 0.45% increment in imports. Concurrently, the U.S., EU and certain Asian economies exhibit expansions within the electronic sector, indicating a GVC realignment. The “Chip Act” implementation precipitates a significant divergence in GVC participation across different countries and industries, notably impacting the electronics sector.

Through a meticulous temporal analysis, this manuscript unveils the nuanced economic shifts within the GVC, substantially bridging the empirical void in existing literature. This narrative accentuates the profound implications of policy regulations on global trade dynamics, contributing to the discourse on international economic policy and industry evolution.

We evaluated the impact of the US “Chip Act” on the participation of the Chinese electronics industry in the global value chain based on the dynamic CGE model. This is a meaningful attempt to use the GTAP-VA model to analyze the electronics industry in China.

The interaction between policy regulations and global value chain (GVC) dynamics is pivotal in understanding the contemporary global trade framework, especially within technology-driven sectors. The US “Chips Act” represents a significant regulatory milestone with potential ramifications on the Chinese electronic industries' engagement in the GVC.

The significance of this paper is that it quantifies for the first time the impact of the US Chip Act on the GVC participation index of East Asian countries in the context of US-China decoupling. With careful consideration of strategic aspects, this paper substantially fills the empirical gap in the existing literature by presenting subtle economic changes within GVCs, highlighting the profound implications of policy regulation on global trade dynamics.

The challenges faced by China's high-end equipment manufacturing (HEEM) industry are becoming clearer in the process of global supply chain (GSC) reconfiguration. The purpose of this study is to investigate how China's HEEM industry has been affected by the GSC reconfiguration, as well as its short- and long-term strategies.

The authors adopted a multi-method approach. Interviews were conducted in Phase 1, while a three-round Delphi survey was conducted in Phase 2 to reach consensus at the industry level.

The GSC reconfiguration affected China's HEEM supply chain (SC). Its direct effects include longer lead times, higher purchasing prices and inconsistent supply and inventory levels of key imported components and materials. Its indirect effects include inconsistent product quality and cash flows. In the short term, China's HEEM enterprises have sought to employ localized substitutes, while long-term strategies include continuous technological innovation, industry upgrades and developing SC resilience.

This study not only encourages Chinese HEEM enterprises to undertake a comprehensive examination of their respective industries but also provides practical insights for SC scholars, policymakers and international stakeholders interested in how China's HEEM industry adapts to the GSC reconfiguration and gains global market share.

This book chapter focuses on firstly social innovation and tools used to address the social needs and foster social innovation initiatives. Looking at the world economic forum and how it supports the social innovations, currency swings, low paying jobs growing rapidly, rapid change and growth as a result of high volatility and high returns, respectively. Secondly looking at the emerging market brought about by the social innovations and how they interconnect. Leading innovation emerging market has three main industries semiconductors, fin-tech, and electric cars. It also looks at the significance of technology in the development of business emerging markets, the role of technology in the emerging market and activities over the decades. Small firms in emerging areas face three major challenges which technology might help overcome. The challenges are trust, sustainability, and network. The role of technology replacing analog chip used for power supply, sensors, wideband signal make up the large semiconductors in the United States replaced with digital chip such as logical operations, data storage, computer information management all this have given birth to artificial intelligence, autonomous machines, self-driving cars, supply-chain management, cloud computing, and software-as-a-service (SaaS) applications are all made possible by digital chips. These are also used for e-commerce, mobile payment, fine-tech, 5G telecom, health-care advancement, remote learning, online entertainment, and cloud computing. Technical advancements that has sparked a revolution that would be especially advantageous for emerging market and small-cap enterprises are the causes of these benefits of how it has affected countries such as Europe, the United States, China, and India to mention a few.

Wafer bonding is a key process for 3 D advanced packaging of integrated circuits. It requires very high accuracy for the wafer alignment. To solve the problems of large movement stroke, position calibration error and low production efficiency in optical alignment, this paper aims to propose a new wafer magnetic alignment technology (MAT) which is based on tunnel magneto resistance effect. MAT can realize micro distance alignment and reduces the design and manufacturing difficulty of wafer bonding equipment.

The current methods and existing problems of wafer optical alignment are introduced, and the mechanism and realization process of wafer magnetic alignment are proposed. Micro magnetic column (MMC) marks are designed on the wafer by the semiconductor manufacturing process. The mathematical model of the space magnetic field of the MMC is established, and the magnetic field distribution of the MMC alignment is numerically simulated and visualized. The relationship between the alignment accuracy and the MMC diameter, MMC remanence, MMC thickness and sensor measurement height was studied.

The simulation analysis shows that the overlapping double MMCs can align the wafer with accuracy within 1 µm and can control the bonding distance within the micrometer range to improve the alignment efficiency.

Magnetic alignment technology provides a new idea for wafer bonding alignment, which is expected to improve the accuracy and efficiency of wafer bonding.

Full adder cells are building blocks of arithmetic circuits and affect the performance of the entire digital system. The purpose of this study is to provide a low-power and high-performance full adder cell.

Approximate computing is a novel paradigm that is used to design low-power and high-performance circuits. In this paper, a novel 1-bit approximate full adder cell is presented using the combination of complementary metal-oxide-semiconductor, transmission gate and pass transistor logic styles.

Simulation results confirm the superiority of the proposed design in terms of power consumption and power–delay product (PDP) criteria compared to state-of-the-art circuits. Also, the proposed full adder cell is applied in an 8-bit ripple carry adder to accomplish image processing applications including image blending, motion detection and edge detection. The results confirm that the proposed cell has premier compromise and outperforms its counterparts.

The proposed cell consists of only 11 transistors and decreases the switching activity remarkably. Therefore, it is a low-power and low-PDP cell.