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To study the behaviour of voids in PBGA solder joints and their influence on the lifetime of lead‐free solder joints.

The behaviour of voids was studied using micro via and land pad PWBs, PBGA components, and by measuring voids in the solder joints. The lifetimes of solder joints were tested using accelerated temperature tests.

Number of factors affecting the solder joint lifetimes were found. The voids were discovered to have a significantly large influence on the solder joints.

The findings can be used to achieve better soldering results, methods, and designs.

In this paper, the effect and the behaviour of voids were studied profoundly. The findings can be valuable to researchers and process personnel.

To provide further knowledge of the effect of solder composition and PCB surface finish on the creep properties of lead‐free SnAgCu solder joints.

Single‐overlap shear specimens were prepared for the creep testing. The test matrix included three different SnAgCu pastes with hypoeutectic, eutectic, and hypereutectic compositions. An Sn63Pb37 solder paste was used as a reference. The PCB finishes used were NiAu, organic solderability preservative (OSP) and immersion tin. The creep tests were performed at 85 and 105°C using a dead‐weight system.

According to the results, the SnAgCu solder with eutectic or near‐eutectic composition is the safest choice when the creep behaviour of solder joints is considered. Of the three different PCB surface finishes, immersion tin is the most favourable choice for use with SnAgCu joints when creep is the predominant deformation mechanism in the joints. On the NiAu finish the creep properties of SnAgCu solder joints were significantly weaker in eutectic and hypereutectic SnAgCu joints than on Sn and OSP.

The results can be used to enhance the reliability of SnAgCu joints in demanding conditions, when special attention is paid to the choice of PCB surface finish and SnAgCu solder composition.

This paper will describe tests of the interconnect reliability of BGA components with tin‐lead bumps soldered with lead‐free solder paste during temperature cycling. Tin‐lead BGA components soldered with tin‐lead solder paste and lead‐free BGA components soldered with lead‐free solder paste were used as a reference. The lead‐free solder used was eutectic tin‐silver‐copper. Two kinds of surface finishes were used on the printed circuit boards (PCB), an immersion gold over electroless nickel and an organic solderability preservative. The test PCBs were temperature‐cycled for 2500 cycles in the range of −40°C to +125°C and they were continuously electrically monitored during the cycling. The results of the temperature cycling test showed that lead‐ containing BGA components soldered with lead‐free solder paste don't show any serious reliability risks and can actually withstand temperature cycling stresses better than entirely lead‐free BGA assemblies.

In this study, the researchers explored the roles played by digital technologies and digital innovation (DI) in Pakistan's Information, Communication and Technology (ICT) companies' firm performance (FP).

The researchers used a quantitative study to gather cross-sectional data from employees working in Pakistan's ICT companies. The authors based this study's findings on 396 valid samples.

The structural equation modeling (SEM) findings underline that digital capability (DC), digital orientation (DO) and digital transformation (DT) have positive and significant effects on DI and FP. Moreover, there is a positive and significant relationship between DI and FP. Finally, DI mediates DC's, DO's and DT's associations with FP.

By committing to embracing new digital technologies and updating existing DCs to become innovation leaders and to improve FP, the findings will help sectors to take advantage of developing digital technologies and the trend toward digitalization. The results are also valuable for policymakers when considering if SMEs should be provided with more money for the digital up-skilling of their employees. Finally, this study's findings enrich the depth of literature about companies' use of digital technologies.

This study's empirical findings confirm the roles played by DC, DO and DT in improving DI and FP in a developing country such as Pakistan.