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Process mapping is a very effective tool, but often overlooked, in determining what the present process is, evaluating other potential improved processes and determining an optimum process. This is an invaluable tool for effective re‐engineering. It is best used at the micro‐level, and it is essential to consider interfaces and time factors. A process map is used to understand your business and improve the performance of your processes.

Re‐engineering is a “hot” topic for managers. Many are aware of the spectacular claims made for re‐engineering; fewer realize the infrastructure necessary to apply re‐engineering successfully. Suggests that organizations have a simplistic or a limited view of the potential of re‐engineering; outlines critical success factors that organizations must be aware of, and sets out approaches to delivering the real potential of re‐engineering through a structured approach to interpreting the basic concepts

This paper describes the approach used by the authors to select the flux materials for a simple water‐soluble solder paste flux formulation, what those materials were, and how they interacted to give the correct properties. Consistency of formulation and performance are discussed with emphasis on the need for adequate process parameter control as with any formulation. With this water‐soluble paste formulation various circuit card designs were successfully built possessing 25‐mil pitch, and larger, components. The cards were cleaned in aqueous cleaners and passed IBM standard insulation resistance testing.