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This study aims to introduce a novel technique for nonlinear sensor time constant estimation and sensor dynamic compensation in hot-bar soldering using an extended Kalman filter (EKF) to estimate the temperature of the thermocouple.

Temperature optimal control is combined with a closed-loop proportional integral differential (PID) control method based on an EKF. Different control methods for measuring the temperature of the thermode in terms of temperature control, error and antidisturbance are studied. A soldering process in a semi-industrial environment is performed. The proposed control method was applied to the soldering of flexible printed circuits and circuit boards. An infrared camera was used to measure the top-surface temperature.

The proposed method can not only estimate the soldering temperature but also eliminate the noise of the system. The performance of this methodology was exemplary, characterized by rapid convergence and negligible error margins. Compared with the conventional control, the temperature variability of the proposed control is significantly attenuated.

An EKF was designed to estimate the temperature of the thermocouple during hot-bar soldering. Using the EKF and PID controller, the nonlinear properties of the system could be effectively overcome and the effects of disturbances and system noise could be decreased. The proposed method significantly enhanced the temperature control performance of hot-bar soldering, effectively suppressing overshoot and shortening the adjustment time, thereby achieving precise temperature control of the controlled object.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

This paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with different structure parameters under increasingly harsh environment.

A finite element model for a system-in-package module was built with moisture-thermal-mechanical-coupled effects to study the subsequences of hygrothermal conditions.

It was found in this paper that the moisture diffusion path was mainly dominated by hygrothermal conditions, though structure parameters can affect the moisture distribution. At lower temperatures (30°C~85°C), the direction of moisture diffusion was from the periphery to the center of the module, which was commonly found in simulations and literatures. However, at relatively higher temperatures (125°C~220°C), the diffusion was from printed circuit board (PCB) to EMC due to the concentration gradient from PCB to EMC across the EMC/PCB interface. It was also found that there exists a critical thickness for EMC and PCB during the moisture diffusion. When the thickness of EMC or PCB increased to a certain value, the diffusion of moisture reached a stable state, and the concentration on the die surface in the packaging module hardly changed. A quantified correlation between the moisture diffusion coefficient and the critical thickness was then proposed for structure parameter optimization in the design of system-in-package module.

The different moisture diffusion behaviors at low and high temperatures have seldom been reported before. This work can facilitate the understanding of moisture diffusion within a package and offer some methods about minimizing its effect by design optimization.

In 2022, the Baltimore professional development school (PDS) partner schools, John Ruhruh Elementary/Middle School (JREMS) and Notre Dame of Maryland University (NDMU) received funds through a Maryland Educational Emergency Revitalization (MEER) grant to determine (a) to what extent additional resources and professional development would increase JREMS teachers’ efficacy in technology integration and (b) to what extent NDMU professional development in the form of workshops and self-paced computer science modules would result in greater use of technology in the JREMS K-8 classrooms. Results indicated a statistically significant improvement in both teacher comfort with technology and integrated use of technology in instruction.

Survey data were collected on teacher-stated comfort with technology before and after grant implementation. Teachers’ use of technology was also measured by unannounced classroom visits by administration before and after the grant implementation and through artifacts teachers submitted during NDMU professional development modules.

Results showing significant increases in self-efficacy with technology along with teacher integration of technology exemplify the benefits of a PDS partnership.

This initiative was original in its approach to teacher development by replacing required teacher professional development with an invitation to participate and an incentive for participation (a personal MacBook) that met the stated needs of teachers. Teacher motivation was strong because teammates in a strong PDS partnership provided the necessary supports to induce changes in teacher self-efficacy.

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

As data centres grow in size and complexity, traditional air-cooling methods are becoming less effective and more expensive. Immersion cooling, where servers are submerged in a dielectric fluid, has emerged as a promising alternative. Ensuring reliable operations in data centre applications requires the development of an effective control framework for immersion cooling systems, which necessitates the prediction of server temperature. While deep learning-based temperature prediction models have shown effectiveness, further enhancement is needed to improve their prediction accuracy. This study aims to develop a temperature prediction model using Long Short-Term Memory (LSTM) Networks based on recursive encoder-decoder architecture.

This paper explores the use of deep learning algorithms to predict the temperature of a heater in a two-phase immersion-cooled system using NOVEC 7100. The performance of recursive-long short-term memory-encoder-decoder (R-LSTM-ED), recursive-convolutional neural network-LSTM (R-CNN-LSTM) and R-LSTM approaches are compared using mean absolute error, root mean square error, mean absolute percentage error and coefficient of determination (R²) as performance metrics. The impact of window size, sampling period and noise within training data on the performance of the model is investigated.

The R-LSTM-ED consistently outperforms the R-LSTM model by 6%, 15.8% and 12.5%, and R-CNN-LSTM model by 4%, 11% and 12.3% in all forecast ranges of 10, 30 and 60 s, respectively, averaged across all the workloads considered in the study. The optimum sampling period based on the study is found to be 2 s and the window size to be 60 s. The performance of the model deteriorates significantly as the noise level reaches 10%.

The proposed models are currently trained on data collected from an experimental setup simulating data centre loads. Future research should seek to extend the applicability of the models by incorporating time series data from immersion-cooled servers.

The proposed multivariate-recursive-prediction models are trained and tested by using real Data Centre workload traces applied to the immersion-cooled system developed in the laboratory.

Induction heating processes need to adapt to complex geometries or variable processes that require a high degree of flexibility in the induction heating setup. This is usually done using complex inductors or adaptable resonant tanks, which leads to costly and constrained implementations. This paper aims to propose a multi-level, versatile power supply able to adapt the output to the required induction heating process.

This paper proposes a versatile multilevel topology able to generate versatile output waveforms. The methodology followed includes simulation of the proposed architecture, design of the power electronics, control and magnetic elements and laboratory tests after building a 10-level prototype.

The proposed converter has been designed and tested using an experimental prototype. The designed generator is able to operate at 1 kVpp and 100 A at 250 kHz, proving the feasibility of the proposed approach.

The proposed converter enables versatile waveform generation, enabling advanced tests and processes on induction heating system. The proposed system allows for multifrequency generation using a single inductor and converter, or advanced tests for inductive and capacitive components used on induction heating systems. Unlike previous multifrequency proposals, the proposed generator enables a significantly improved versatility in terms of operational frequency and amplitude in a single converter.

The purpose of this study is to increase awareness of current supply chain (SC) security-related issues by providing an extensive analysis of existing SC security solutions and their limitations. The security of SCs has received increasing attention from researchers, due to the emerging risks associated with their distributed nature. The increase in risk in SCs comes from threats that are inherently similar regardless of the type of SC, thus, requiring similar defence mechanisms. Being able to identify the types of threats will help developers to build effective defences.

In this work, we provide an analysis of the threats, possible attacks and traceability solutions for SCs, and highlight outstanding problems. Through a comprehensive literature review (2015–2021), we analysed various SC security solutions, focussing on tracking solutions. In particular, we focus on three types of SCs: digital, food and pharmaceutical that are considered prime targets for cyberattacks. We introduce a systematic categorization of threats and discuss emerging solutions for prevention and mitigation.

Our study shows that the current traceability solutions for SC systems do not offer a broadened security analysis and fail to provide extensive protection against cyberattacks. Furthermore, global SCs face common challenges, as there are still unresolved issues, especially those related to the increasing SC complexity and interconnectivity, where cyberattacks are spread across suppliers.

This is the first time that a systematic categorization of general threats for SC is made based on an existing threat model for hardware SC.

The purpose of this paper is to introduce a novel cross (+) type yoke with hybrid electromagnets and new reluctance modeling to precisely calculate attraction force is given.

The comparison of attraction force and torque analyses between the proposed formulation and the existing formulation in the literature is comparatively presented. For the correctness of the force and torque values calculated in the model created, the system was created in ANSYS Maxwell and its accuracy was proved by making analyses. The maglev carrier system is inherently unstable from the point of view of control engineering. For that, it needs an active controller to eliminate this instability. For the levitation of the carrier system, it is necessary to design a controller in three axes (z, α and β). I-PD controller was designed for the air gap control of the carrier system in three axes and the controller parameters were determined by the canonical method.

While the new formulation proposed in the modeling of the carrier system has a maximum error of 1.03%, the existing formula in the literature has an error of 16.83% in the levitation distance point.

A novel cross-type hybrid carrier system has been proposed in the literature. With the double integral used in modeling the system, it takes a long time to solve symbolically, and it is difficult to simulate dynamic behavior in control validation. To solve this problem, attraction force and inclination torque values are easily characterized by new formulation and besides the simulations are conducted easily. The experimental setup was manufactured and assembled, and the carrier system was successfully levitated, and reference tracking was performed without overshoot.