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After a brief introduction to the advantages and method of construction of flip chip solder bond devices, this paper looks at different techniques that can be used to inspect these devices at various stages in their construction. These techniques include optical, infra‐red, acoustic and electron microscopy, radiograph, electrical and tensile testing. The advantages and limitations of each of the techniques are discussed and an outline inspection schedule is suggested.

Purpose – Trust and justice are generally considered distinct but closely related constructs. Individual perceptions of procedural justice and trustworthiness have been shown to reciprocally influence one another, each independently promoting trust (Colquitt & Mueller, 2007). We consider instances where these may instead diverge: how intentional efforts to build trust may unintentionally erode justice, and how the use of fair procedures may reduce trust.

Approach – We argue that the anomalous divergences between trust and justice are evident only when simultaneously considering judgments at two levels: the interpersonal level (i.e., within dyads inside the team) and the team level (i.e., shared perceptions of all team members).

Implications for research and practice – The unintended effects described in this chapter describe a “dark side” to a number of taken-for-granted practices in organizational life (favor-paying, punishment processes, and approaches to redress). We expect that this chapter should promote new research using the team context to bridge the trust and justice literatures, and provoke a careful reconsideration among practitioners of these approaches.

Originality – We propose three previously overlooked disjunctures between trust and justice. First, we show how procedurally unfair approaches to allocating favors may be beneficial in building dyadic trust between team members. Next, we describe how fair (open and transparent) group processes for punishing perpetrators may erode trust by skewing group members’ perceptions of the prevalence of trust violations. Finally, we describe how the most effective forms of redress at the interpersonal level may provoke perceptions of injustice at the team level.

The problem of providing a reliable and cost‐effective interconnection system between semiconductor devices and other add‐on components and the film circuit has been central to the development of hybrid microelectronic technology since its inception. Many of the techniques used have been adopted from those developed primarily for the semiconductor industry, and not all of these have been entirely suited to hybrid microcircuit production. Thermocompression bonding using gold wire, for example, while acceptable as a process for lead attachment to discrete transistors or semiconductor integrated circuits, in which the duration of exposure to raised temperature is quite short, may be the cause of early or delayed failure when applied to the assembly of a hybrid of any complexity, when the time at temperature is necessarily much longer.

A measurement tool, capable of monitoring misalignment of layers in multilayer printed circuit boards, is described. Its uses, limitations and its advantages for use in SPC and reliability predictions are highlighted.

The purpose of this paper is to identify the major parameters which affect the chances of contamination occurring, and then to evaluate conventional cleaning techniques with respect to these factors. The paper will next describe a new approach to contamination control which minimises the risk of contamination in a cost‐effective manner. In conclusion, some aspects of the circuit board manufacturing process which are particularly sensitive to contamination and which may benefit from the application of ‘Just in Time’ cleaning are described.