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The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies.

Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties.

The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices.

This paper shows the advantages of new technologies and materials in PCB thermal management.

We focus on the internal workings of a university organization’s response to institutional plurality. In the field of higher education, both organizations and individuals are prescribed competing demands due to academic logic and the logic of managerialism. We interpret six individual experiences of institutional plurality and illuminate how social position, disposition, emotions, and apprehension regarding plurality affect their response to shifting emphases in the logics of the university. In addition, we show that although there may appear to be harmony in the organizational-level response to institutional plurality, turmoil may be affecting the organization’s members, highlighting the importance of looking at how people experience institutional logic multiplicity.