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Metal core PCBs have been in use for some 20 years in designs where maximum thermal management in the form of heat dissipation is desirable. As past methods of fabrication involved techniques not necessarily available at facilities using metal core PCBs designs, a Manufacturing Technology programme was conducted to develop and implement a scheme that used only standard multilayer production materials and processes. A drilled aluminium core panel was laminated to copper foil employing B‐stage resin and two lamination cycles. Redrilling on NC machines followed, prior to desmearing, conventional electroless and electrolytic copper plating, and normal processing steps such as dry film photoimaging, etching and solder coating. Boards thus produced functioned efficiently in standard tests, exhibiting superior values for capacitance when compared with pure epoxy boards.

A review has been made of the various factors involved in the design and manufacture of bonded heat sinks for printed circuit boards. Among the factors discussed are the design of heat sink thicknesses and the interrelationship with component lead geometry, the design of heat sink geometry as related to the fabrication of the heat sinks and bonding media, and the complexities of the bonding process itself.

Case studies were conducted with two small apparel businesses in Mexico to determine the physical and human resources critically influencing full‐package apparel manufacturing and export. Data analysis deductively focused on the use of local resources, the role of technology, understanding of the export market and the ability to develop a product suitable for that market, business skills needed for production and delivery, and availability of capital. Based on the results, a study guide was developed for use by individuals, small business owners, cooperatives, and communities as they promote development and job creation in Mexico through apparel production and export under NAFTA.