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1 – 2 of 2Eric Beyne, Rita Van Hoof, Tomas Webers, Steven Brebels, Stéphanie Rossi, François Lechleiter, Marianna Di Ianni and Andreas Ostmann
A novel interconnect technology, introducing thin film on a laminate substrate base, is presented. A specially constructed laminate board is used as a substrate for the thin film…
Abstract
A novel interconnect technology, introducing thin film on a laminate substrate base, is presented. A specially constructed laminate board is used as a substrate for the thin film build‐up process. The main characteristics of the laminate core substrate are the z‐axis electrical connections, the absence of holes in the substrate and the very flat nature of the top surface. As a result, the base substrate can be processed further in a thin film processing line. The manufacturing and properties of these substrates are discussed.
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