Awards for Excellence

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 2002



(2002), "Awards for Excellence", Microelectronics International, Vol. 19 No. 3.



Emerald Group Publishing Limited

Copyright © 2002, MCB UP Limited

Awards for Excellence

Eric Beyne

Rita Van Hoof

Tomas Webbers

Steven BrebelsIMEC Leuven Belgium

Stéphanie Rossi

Francois LechleityerCIMULEC Ennery, France

Marianna Di IanniCaiLab Technologis, Preganan-Milanese, Italy and

Andreas OstmannTUBerlin Berlin, Germany

Are the recipients of the journal's Outstanding Paper Award for Excellence for their paper

High density interconnect substrates using multilayer thin film technology on laminate substrates - (MCM-SL/D)

which appeared in Microelectronics International Vol. 18 No. 3 2001

A novel interconnect technology, introducing thin film on a laminate substrate base, is presented. A specially constructed laminate board is used as a substrate for the thin film build-up process. The main characteristics of the laminate core substrate are the z-axis electrical connections, the absence of holes in the substrate and the very flat nature of the top surface. As a result, the base substrate can be processed further in a thin film processing line. The manufacturing and properties of these substrates are discussed.

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