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Thick film technology is increasingly used in hybrid microelectronic circuits throughout the world. It is entering areas of electronics hitherto dominated by other technologies. Materials are the most important parameter in any technological development. A single material can generate several technologies (e.g., silicon). The role of a Materials Scientist, particularly in the case of Thick Film Materials, has to be very comprehensive. A ‘Vertical Integration System’ is followed in the study and development of thick film materials. This has helped in understanding the complex reactions taking place and in rectifying the defects formed during thick film processing. It has been amply rewarded during the development of several conducting and resistive materials and while carrying out the basic studies of other materials as thick films. Some future trends in this area have been suggested for adapting this fascinating thick film technology.

As announced in the May issue of Hybrid Circuits, ISHM‐Benelux is organising a one‐day conference on applications of hybrid circuit technology.

A recent meeting involved co‐operation with the organisers of the Canadian High Technology Show and the local Chapter of the SMTA. The programme included an inspiring keynote address by Mr Frank J. Pipp, Xerox Corporation. The topic of the address was ‘Malcolm Baldridge National Quality Control and the Evaluation of Total Quality Control in Xerox Corporation.’

Corrosion rates of copper in 1N sulphuric acid with various concentrations (10−8 to 10−4 M) of 2, 4‐dinitrophenylhydrazine (2, 4‐DNP) are determined by weight loss method. The corrosion rates (under diffusion control), are a function of the stirring rate and the concentration of 2, 4‐DNP. The corrosion rate decreased markedly on increasing the concentration of 2, 4‐DNP. The maximum corrosion inhibition (85%) is observed at 10−4 M 2, 4‐DNP. The anodic polarization data and the drift in corrosion potential with time towards the less noble direction reveal the inhibition of cathodic reaction of the corrosion process by 2, 4‐DNP. A mechanism is proposed to explain the inhibitor action of 2, 4‐DNP on copper during corrosion in 1N sulphuric acid.

The venue for this year's ISHM‐Benelux Autumn Conference and ‘table‐top’ display meeting on 12 October will be the Institut Supérieur Industriel de l'Etat, Mons, Belgium.

The ISHM CAN‐AM Chapter recently organised a half‐day programme of paper presentations followed by a tour of a local hybrid facility. The event took place on 26 April at the Holiday Inn, Montreal (Pointe Claire), Quebec, with the theme of the papers concentrating on advances in hybrid manufacturing processes and some coverage of SMT.

The purpose of this paper is to understand determinants of food waste through analysing patterns of practices including shopping, planning, consumption of leftovers and attitudes around best-before dates.

A survey and waste composition analysis of 142 households was conducted in the City of Toronto. Bivariate analyses and confirmatory factor analysis (CFA) using a structural equation model were used to identify relationships between per capita food waste, household socio-demographic characteristics and household food practices.

Constructs related to planning practices and best-before date practices were identified through the CFA. Household size and the best-before construct were negatively correlated with per capita food waste. The planning construct had no correlation, which may be attributed to the influence of the retail environment in encouraging unplanned purchases. The best-before construct was significantly correlated with the presence of children in the home, an indicator of the compromises that parents make in domestic provisioning to ensure healthy foods for their children, such as more caution in handling items after their best-before dates.

This is the first study of its kind that uses directly measured per capita food waste from a waste composition study in a structural equation model with a construct related to best-before dates to determine drivers of food waste. It is also the first to find that children in the home can have an indirect influence on food waste through the household's best-before practices.

The effect of some pyrazoline derivatives as inhibitors on the dissolution of A1 in 2 mol.L−1 HC1 has been studied by weight‐loss, galvanostatic polarization, polarographic and scanning electron microscopy methods. Additions of Cu2+ Co2+ or Ni2+ ions increases the efficiency of the inhibitors.

The microwave properties of microstripline at S‐band and X‐band and ?/2 rejection filter with midband rejection at 3 GHz fabricated by thick film technology are studied. The effect of an overcoat of Ag thin film of thickness 2 µm deposited by ion plating and electroless plating on Ag and Pd‐Ag thick film circuits is reported. There is a drastic improvement in the performance of the thick film circuits after overcoating. This is attributed to the superior edge definition whereby losses are reduced. As the edge is smoother, especially at the coupling area of the filter, there is tighter coupling, thus increasing the Q of the filter. The overcoat may also reduce the large open areas of the thick film, giving a smoother upper surface finish. This type of metallic overcoat, i.e., hybrid of thick and thin film, may reduce the need for costly and time‐consuming functional trimming and expensive thick film materials.

I was an invited speaker to the ISHM‐Benelux meeting. As I arrived early, I also sat in on the committee meeting as an observer. Jos B. Peeters was the outgoing president and the incoming committee was widened to about 15 members compared with the previous 6. Following the unanimous election of all those nominated, the committee reconvened and elected Mr Kwikkers as the new president of ISHM‐Benelux. He is a professor at the Technische Hogeschole in Delft.