Performance Enhancement of Thick Film Microstripline Circuits by Metallic Thin Film Overcoat

Abstract

The microwave properties of microstripline at S‐band and X‐band and ?/2 rejection filter with midband rejection at 3 GHz fabricated by thick film technology are studied. The effect of an overcoat of Ag thin film of thickness 2 µm deposited by ion plating and electroless plating on Ag and Pd‐Ag thick film circuits is reported. There is a drastic improvement in the performance of the thick film circuits after overcoating. This is attributed to the superior edge definition whereby losses are reduced. As the edge is smoother, especially at the coupling area of the filter, there is tighter coupling, thus increasing the Q of the filter. The overcoat may also reduce the large open areas of the thick film, giving a smoother upper surface finish. This type of metallic overcoat, i.e., hybrid of thick and thin film, may reduce the need for costly and time‐consuming functional trimming and expensive thick film materials.

Citation

Puri, V. (1994), "Performance Enhancement of Thick Film Microstripline Circuits by Metallic Thin Film Overcoat", Microelectronics International, Vol. 11 No. 2, pp. 28-30. https://doi.org/10.1108/eb044530