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This paper aims to examine the impacts of corporate entrepreneurship, national policies and supply chain collaboration on the innovativeness of manufacturers of light emitting diode (LED) in Malaysia.

The data were collected by using questionnaire survey from the manufacturers involved in the various echelon of the supply chain. The data collected were analyzed by using partial least square (PLS).

Corporate entrepreneurship plays a moderating role in the relationship between national policies, supply chain collaboration and innovativeness.

This study is only focusing on the supply chain of LED in Malaysia; hence, the results may not be suitable to be generalized to wider populations.

The findings of this study could help the local companies to understand on how, as entrepreneurs, they could expand from small scale to contract manufacturers through enhancing innovativeness. This is important as failure to do so may cause them to be excluded from the global supply chain.

This study expands the existing literature by providing empirical evidence from the perspective of an emerging country, namely, Malaysia. It also attempts to close the gaps by examining the role of corporate entrepreneurship as the moderating variable.

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.