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Non‐corrosive rosin fluxes have historically been used for telephone communications assemblies because they provide a measure of reliability even if the flux is not totally removed from the assembly. While cleaning is not always necessary from a reliability standpoint, testing issues, product appearance, operating performance and customer requirements must also be considered when making the decision whether or not to clean. As the electronics industry packages more and more functionality on less and less real estate, soldering yields need to increase in order for the assembly process to remain profitable. This requires not only attention to the product's design for manufacturing but it may also require aggressive fluxes to be used in the assembly process. When aggressive fluxes are employed, the necessity for cleaning is greatly increased. The particular combination of flux and cleaning option depends on product design, process capabilities, end point requirements, and environmental considerations. Pending restrictions on the production and use of chlorofluorocarbons (CFCs), and the potential for tighter controls on chlorinated solvents and aqueous detergent effluents, are certain to add to the cost of standard processes. For these reasons alternative cleaning processes have been explored. The evaluation and subsequent use of water soluble flux with ‘water only’ cleaning, terpene cleaning of rosin flux residues, low solids flux ‘no‐clean’ wave soldering and ‘no‐clean’ assembly using reflowed rosin based solder pastes within AT&T are reviewed. A user's assessment of aqueous and semi‐aqueous cleaning is presented which indicates that there are acceptable alternatives to CFCs.

Organic solderability preservative (OSP) coatings are not new. They have been used successfully with aggressive water soluble flux for assembly of through‐hole only PWBs. However, the multiple heating cycles required for mixed technology assembly and use of no‐clean low solids flux (LSF) for wave solder assembly have placed a greater demand on the solderability protection provided by OSPs. Wetting balance and float testing were used to evaluate numerous OSPs as well as the potential for these surface finishes to be used for ‘No‐Clean’ assembly. Although these laboratory evaluations revealed that OSPs are not as robust as SnPb, they did indicate the assembly processes and materials which could work with OSPs. Additional simulated assembly trials with test vehicles confirmed that thick OSP pre‐flux coatings interfere with soldering and that the solderability of surfaces with thin OSPs degrades when heated in an air environment. Since none of the OSPs evaluated outperformed the imidazole currently in use at AT&T, a no‐clean LSF assembly production trial with a mixed technology telecommunication circuit pack was conducted to compare imidazole with hot air solder levelled surfaces. The production trial and laboratory evaluations resulted in the development of an application model. The elements of the application model are not complicated: (1) use thin OSPs, (2) avoid baking, (3) use as aggressive a flux as possible, (4) apply as much flux as possible, (5) apply the flux where you want solder to wet, and (6) use nitrogen inerted processes whenever possible. Combination of these elements has led to the successful implementation of OSPs for no‐clean assembly. Funding for this effort was obtained through the National Center for Manufacturing Sciences (NCMS) Printed Wiring Board Interconnect Program.

This study examines solvent extract conductivity (SEC) testing, e.g., Ionograph or Omega Meter testing, which measures ionic cleanliness of printed wiring boards (PWBs). SEC has been a quality control (QC) monitor to assure product electrical reliability. Typical SEC measurements occur after wave soldered products have been solvent‐cleaned. This study concerns SEC testing on new wave soldering processes that involve no solvent cleaning, i.e., inert gas soldering with ‘no clean’ fluxes. Results show ionic residues from ‘no clean’ fluxes may have other characteristics that make QC testing for ionic cleanliness inappropriate. However, SEC may be appropriate as a process control monitor after soldering with these fluxes. An Ionograph measured SEC response for the following chemicals: NaCl, NaF, NaBr, KCl, MgCl2, CaCl2, HCl, succinic acid, malic acid, glutaric acid, adipic acid and ethylene glycol. The list includes inorganic salts, strong electrolytes, which may arise from manufacturing or PWB materials. The list also includes weak organic acids (WOAs) common to ‘no clean’ fluxes. One non‐ionic hygroscopic chemical, ethylene glycol, was studied. Ionograph response was measured via (i) direct injection of aqueous solutions and (ii) immersion of PWBs with individual chemicals as surface deposits. All ionisable compounds, including all WOAs, produced substantial SEC response. Surface conductivity was measured at 35°C/90% relative humidity (RH) with controlled amounts of the above chemicals deposited on clean PWB test circuits. Surface loadings corresponded to the molar‐ionic equivalent of 2.0 ?g/cm2 NaCl. In addition, NaCl, adipic acid and polyethylene glycol (PEG 400) were examined as a function of concentration. Several ionisable chemicals including all WOAs produced no measurable effect, i.e., surface conductivities were indistinguishable on clean and deposited specimens. Surface conductivity increased for ionic contaminants with critical RH below ∼80% and for the non‐ionic hygroscopic glycol. SEC measurements and surface conductivities were compared. The latter is more directly related to electrical reliability. Although all ionic compounds including the WOAs showed a SEC response, not all enhanced surface conductivity. Achievement of critical RH appears to be the important factor. Adipic acid required the presence of hygroscopic glycol to enhance surface conductivity. Therefore, SEC can be a misleading QC test for electrical reliability when WOA flux residues are present.

The demise of the CFC‐113/alcohol azeotropic solvent for de‐fluxing circuit assemblies after soldering has led, in recent years, to the electronics assembly industry being offered other cleaning technologies, some new and some new to this industry. In terms of uptake, one of the most successful will be semi‐aqueous cleaning involving the use of an organic solvent of low volatility to dissolve the contamination followed by an aqueous rinsing process. Two families of solvent have evolved based on natural products (terpenes) and synthetic hydrocarbon chemicals. This paper reviews the possible semi‐aqueous processes and the development of the solvents that has taken place. The cleaning performance is considered as well as the potential for effluent control and fully closed‐loop systems.

Weak organic acids (WOAs) are commonly used as activators in no‐clean fluxes. Surface insulation resistance (SIR) was determined as a function of WOA type and residue level through three temperature/humidity test environments. Acidic residue levels were determined after wave solder processing, and after exposure to each of the three test environments. With each of the WOAs studied, the greater the residue level, the lower the SIR. Chemical structure and physical property differences of the WOAs are discussed in the context of differences in SIR observed. WOA volatilisation is found to occur with all four WOAs when exposed to the highest test temperature (85°C). This work shows that testing WOA‐containing solder fluxes at 85°C may not be useful or appropriate.

The threat posed to the environment by CFC cleaning processes for printed circuit boards has led to an investigation of possible alternatives. In a preselection procedure, surprising results were obtained using propylene glycol ethers (PGE), solvents for the paint industry. In this study these ethers are compared with five other groups of cleaners, which can be divided into four water‐based classes: weak acid, neutral, weak and strong alkaline, and water miscible organic solvent cleaners which are non halogen‐containing and biodegradable. The cleaning power of PGE and other cleaners is tested on fluxes for wave and reflow soldering. Comparative results for the different groups are given, combined with surface insulation resistance measurements. Good results can be obtained using alkaline or solvent cleaners. However, it appears that the cleaning results depend heavily on the type of flux used and the choice of a matching cleaning process.

The structure of organisational markets has been altering quite rapidly in recent years. This paper describes some of the changes which have occurred and considers their implications for firms supplying and buying in these markets. Comment is also passed on changes in a number of other factors observable in organisational markets and their influence on marketing strategies is also considered. In British manufacturing industry as a whole the share of the one hundred largest establishments (measured by net output) had risen from 22% in 1949 to 41% by 1970. Examination of individual sectors of manufacturing shows a similar picture in almost every sector and the data for non‐manufacturing industry also shows increased concentration. In the retail grocery trade for example, it is estimated that in 1976 the head offices of 6 multiple chains accounted for 33% of total grocery turnover, while in 1950 all the multiples (10 stores or more) together only accounted for 20%.

Until relatively recently the majority of studies of organisations from a variety of different academic disciplines viewed the organisation as an isolated individual unit and took little account of its interaction with the “rest of the world”. More recently, interest in understanding how organisations interact with their environment has increased and a realisation has grown that the boundary between an organisation and its environment is often very difficult to define, even to the extent that there is “a doubt concerning the relevance of the organisation as an analytical unit” [19, p. 11]. This paper describes one form of inter‐organisational relationship which appears to be growing in importance and which shows that legally defined organisational boundaries do not always bear much relation to the existing boundaries.

Solvent‐clean and no‐clean mass reflow processes of 0.4 mm pitch, 28 mm body size, 256‐pin fine pitch quad flat packs (QFPs) are presented. Emphasis is placed on fine pitch parameters such as printed circuit board (PCB) design, solder paste selection, stencil design, printing technology, component placement, mass reflow, cleaning and inspection. Furthermore, cross‐sections of component/PCB assemblies from both processes have been thoroughly studied using scanning electron microscopy (SEM).

That the provisions of the Montreal Protocol (1987) are inadequate is a well‐known fact. The first revision of the Protocol will be approved by the Parties in June 1990, but the new provisions are still being discussed at the time of writing (December 1989). This paper discusses the various possibilities as to the available technologies which can replace current and future restricted cleaning solvents, as applied to the electronics assembly industry. It places particular emphasis on surface mount technology, as well as conventional assemblies.