Solvent‐clean and no‐clean mass reflow processes of 0.4 mm pitch, 28 mm body size, 256‐pin fine pitch quad flat packs (QFPs) are presented. Emphasis is placed on fine pitch parameters such as printed circuit board (PCB) design, solder paste selection, stencil design, printing technology, component placement, mass reflow, cleaning and inspection. Furthermore, cross‐sections of component/PCB assemblies from both processes have been thoroughly studied using scanning electron microscopy (SEM).
Lau, J., Govila, R., Larner, C., Pao, Y.‐., Erasmus, S., Dolot, S., Jalilian, M. and Lancaster, M. (1992), "No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)", Circuit World, Vol. 19 No. 1, pp. 19-26. https://doi.org/10.1108/eb046187
MCB UP Ltd
Copyright © 1992, MCB UP Limited