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No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)

J. Lau (Hewlett‐Packard Company, Palo Alto, California, USA)
R. Govila (Ford Motor Company, Dearborn, Michigan, USA)
C. Larner (Ford Motor Company, Dearborn, Michigan, USA)
Y.‐H. Pao (Ford Motor Company, Dearborn, Michigan, USA)
S. Erasmus (Hewlett‐Packard Company, Palo Alto, California, USA)
S. Dolot (Ford Motor Company, Dearborn, Michigan, USA)
M. Jalilian (Solectron Corporation, Milpitas, California, USA)
M. Lancaster (Solectron Corporation, Milpitas, California, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 April 1992

Abstract

Solvent‐clean and no‐clean mass reflow processes of 0.4 mm pitch, 28 mm body size, 256‐pin fine pitch quad flat packs (QFPs) are presented. Emphasis is placed on fine pitch parameters such as printed circuit board (PCB) design, solder paste selection, stencil design, printing technology, component placement, mass reflow, cleaning and inspection. Furthermore, cross‐sections of component/PCB assemblies from both processes have been thoroughly studied using scanning electron microscopy (SEM).

Citation

Lau, J., Govila, R., Larner, C., Pao, Y.‐., Erasmus, S., Dolot, S., Jalilian, M. and Lancaster, M. (1992), "No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)", Circuit World, Vol. 19 No. 1, pp. 19-26. https://doi.org/10.1108/eb046187

Publisher

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MCB UP Ltd

Copyright © 1992, MCB UP Limited