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This study aims to better inform environmental management at universities by applying and validating the policy integration processes theory through a case study of Manchester Metropolitan University.

Social network analyses were used to identify, differentiate and categorise working networks of individuals and departments and the interconnections between them.

In an organisation, networks can be developed and active at departmental level but not at individual level. High numbers of departments can be doing work related to sustainable development whilst having low and medium levels of interconnections between departments. Influence of stakeholders throughout the network suggests levels of sustainable development policy integration at individual and departmental.

New insights provide evidence for universities’ environmental managers of the need of developing and implementing strategies that involve individuals’ work between departments by providing incentives, supporting capacity building and staff empowerment.

This paper applied and validated the theory of policy integration processes, showing that work at individual level and between departments needs more attention.

Interconnections among banks are an essential feature of the banking system as it helps in an effective payment system and liquidity management. However, it can be a nightmare during a crisis when these interconnections can act as contagion channels. Therefore, it becomes essentially important to identify good links (non-contagious channels) and bad links (contagious channels).

The article estimated systemic risk using quantile regression through the ΔCoVaR approach. The interconnected phenomenon among banks has been analyzed through Granger causality, and the systemic network properties are evaluated. The authors have developed a fixed effect panel regression model to predict interconnectedness. Profitability-adjusted systemic index is framed to identify good (non-contagious) or bad (contagious) channels. The authors further developed a logit model to find the probability of a link being non-contagious. The study sample includes 36 listed Indian banks for the period 2012 to 2018.

The study indicated interconnections increased drastically during the Indian non-performing asset crisis. The study highlighted that contagion channels are higher than non-contagious channels for the studied periods. Interbank bad distance dominates good distance, highlighting the systemic importance of banking network. It is also found that network characteristics can act as an indicator of a crisis.

The study is the first to differentiate the systemic contagious and non-contagious channels in the interbank network. The uniqueness also lies in developing the normalized systemic index, where systemic risk is adjusted to profitability.

We investigate connections between the development of Fintech and the blue economy from September 14th, 2020, to August 11th, 2023.

In this research, we use a cutting-edge model-free connectedness approach to investigate the relationships between FinTech and blue bond volatility. Our work is the first to investigate the effects of unknown events, such as the COVID-19 pandemic and Ukraine–Russia conflicts, on the interconnection of volatility derived from FinTech development and blue bond volatility.

Our results highlight the two-way relationship between the development of Fintech and the blue economy during our sample period. The net total connectedness shows that the blue economy index is a net shock receiver, especially in late 2021 and the second half of 2022, while most of the fintech indexes in our sample are mainly net shock transmitters. The Ukraine–Russia tension threatens the development of a sustainable blue economy. The development of Fintech plays an important role in promoting the blue economy.

Our results have important policy implications for investors and governments, as well as methods from the spillovers across the various indicators and their interconnections. Sharp information on the primary contagions among these indicators aids politicians in designing the most appropriate policies.

Our paper contributes to the literature in at least four ways. First, as previously stated, our article is the first to investigate the relationship between FinTech and blue bond volatility. Second, this study presented a framework for studying volatility interconnections between distinct variables that is more suited to analyzing these interconnections. In this research, we use a cutting-edge model-free connectedness approach to investigate the relationships between FinTech and blue bond volatility. Third, our work is the first to investigate the effects of unknown events such as the COVID-19 pandemic and Ukraine–Russia conflicts on the interconnection of volatility deriving from FinTech development and blue bond volatility. Lastly, our research provides a daily dataset for the BNP Paribas Easy ECPI Global ESG Blue Economy UCITS ETF to analyze 50 businesses from various markets that are at the forefront of the responsible application of ocean resources and other ESG standards. The Global X FinTech ETF (FINX) and the ARK FinTech Innovation ETF (ARKF) seek exposure to companies developing financial technology innovations. The development sectors include insurance, investment, fundraising and third-party lending by utilizing cutting-edge mobile and digital technologies. Our time series runs from September 14th, 2020, to August 11th, 2023. By using this database, we provide a comprehensive analysis of the link between the volatilities arising from various markets.

The purpose of this article is to better understand the relevance of value creation in the interconnection amongst entrepreneurship, marketing and innovation by reviewing the literature.

The authors employed a systematic review methodology using the Preferred Reporting Items for Systematic Review and Meta-Analyses (PRISMA) protocol to analyse the literature in depth. The articles were selected from the Scopus database and dated from 1987 to 2021. An initial total of 1,158 articles was successively narrowed down to a final list of 123 papers matching the selection criteria. Moreover, content analysis on the sample was performed to explore and analyse whether value creation directly or indirectly appears as a goal or antecedent amongst entrepreneurship, marketing and innovation.

The findings suggest that the literature does not clearly define the topic linkage, and with the authors' results, the authors provide a comprehensive mapping of the contributions to a theoretical framework that synthesises knowledge. Moreover, the authors highlight that the interconnection between marketing and entrepreneurship, i.e. entrepreneurial marketing, requires an innovative approach for satisfying customer needs and creating value. Co-occurrence analysis of the keywords also allowed to identify four clusters that were open to new research streams.

Entrepreneurship, marketing and innovation are recognised research topics in the business and management literature. However, prior research has not provided clear and comprehensive evidence about how these three research topics are linked to each other. This work analyses the hidden relationship amongst them.

The author proposed a friction plunge micro-welding (FPMW) method and applied it to column grid array packaging to realize the connection of copper columns without precision molds assisted positioning. The purpose of this paper is to study the flow behavior of the solder undergoing frictional thermo-mechanical action during the FPMW and to determine the source of the solders in the micro-zones with different microstructure characteristics near the solder/Cu column friction interface.

Three kinds of Sn58Bi/SAC305 and SAC305/Pb90Sn composite solder samples were designed to study the flow behavior of the solder during FPMW using Bi and Pb as tracer elements.

The results show that most of the solders in the position occupied by the copper column was softened and plasticized during the welding process and was extruded to side of the copper column, flowing axially, circumferentially and radially along a trajectory similar to a conical spiral line. Under the drive of the tangential friction force and the radial hold-tight force, the extruded out visco-plastic solders fully mixed with the visco-plastic solders on the sides of the copper column, and bonded with the solders that deformed plastically on the periphery, so that a stir zone and a dynamic recrystallization zone finally evolved. The outside plastically deformed solders evolved into a thermo-mechanical affected zone.

The flow behavior of the solder during the FPMW was determined, as well as the source of the solders in micro-zones with different microstructure characteristics.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

The technological and digital revolution has introduced important changes in the tourism industry. However, capturing the extent of the new tourism 4.0 paradigm is still difficult. This study aims to assess the dimensions related to the concepts of industry 4.0 in tourism and hospitality, tourism innovation and tourism ecosystem when considered simultaneously, and their role in promoting a new wave of competitiveness in the tourism industry.

A bibliometric study was conducted based on tourism 4.0, hotel 4.0, tourism innovation and tourism ecosystem using 120 eligible articles published between 2008 and 2021 from the Web of Science database.

This study demonstrated the advances in industry 4.0 in tourism and hospitality publications over 13 years and identified five interconnected dimensions: (1) knowledge transfer in tourism; (2) networking tourism innovation; (3) sources of tourism innovation; (4) smart tourism ecosystem and (5) innovation research in tourism. It was also concluded that tourism development should be a regional competence based on strategic networking and externalisation of regional knowledge flows.

This bibliometric review provides important implications and recommendations for several players of industry 4.0 in tourism and hospitality and policymakers. Not only did it make it possible to create a state of art, but also to categorise the existing interconnections between the dimensions of Tourism 4.0, Hotel 4.0, Tourism innovation and Tourism ecosystem to optimise its implementation and generate greater value. In addition, practical implications were inferred that improve the tourism sector’s competitiveness, helping strategic decision-making at the level of policymakers and actors in this sector.

Apart from state of the art, this bibliometric review made it possible to categorise the existing interconnections between the dimensions of tourism 4.0, hotel 4.0, tourism innovation and tourism ecosystem to optimise its implementation and generate greater value. Practical implications were inferred that improve the tourism sector’s competitiveness, helping strategic decision-making at the level of policymakers and several players in this sector.

This study addresses the existing literature gap in the interconnection of industry 4.0 with tourism and hospitality by describing the most relevant conceptual interconnections and setting practical implications for improving the competitiveness of the tourism industry. Furthermore, it integrates previous studies and outlines future lines of investigation.

The current study immerses itself in the realm of diversification prospects within a select group of preeminent global stock exchanges. Specifically, the study casts its discerning gaze upon the financial hubs of the United States, Hong Kong, Germany, France, Amsterdam and India. In this expansive vista of international financial markets, the present analytical study aims to unravel the multifaceted opportunities that lie therein for astute portfolio management and strategic investment decisions.

The study encompasses daily time series data spanning from 2019 to 2022. To assess the interconnectedness among these stock indices, advanced statistical techniques, including Johansen cointegration methods and vector autoregressive (VAR) models, have been applied.

The research outcomes reveal both unidirectional and bidirectional relationships between the Indian, Hong Kong and US stock exchanges, encompassing both short-term and long-term time frames. Interestingly, the empirical findings indicate the presence of diversification opportunities between the Indian stock exchange and the stock exchanges of Germany, France and Amsterdam.

These insights hold significant value for both Indian and international investors, including foreign institutional investors (FIIs), domestic institutional investors (DIIs) and retail investors, as they can utilize this knowledge to construct more effective and diversified investment portfolios by understanding the intricate interconnections between these prominent global stock exchanges.

This research undertaking aspires to bring coherence to a landscape rife with divergent interpretations and methodological divergences. We are poised to offer a comprehensive analysis, a beacon of clarity amidst the murkiness, to shed light on the intricate web of interconnections that underpin the world's stock exchanges. In so doing, we seek to contribute a seminal piece of scholarship that transcends the existing ambiguities and thus empowers the field with a deeper understanding of the multifaceted dynamics governing international stock markets.

The study aims to ascertain the influence of solder conductive particle types and substrate widths on the current carrying capability of flex-on-board (FOB) assemblies. By comparing Sn58Bi and SAC305 particles and varying substrate widths, the research sought to provide insights into the stability and performance of solder joints under different scenarios, particularly in high-power applications.

The study used a comprehensive design/methodology, encompassing the investigation of solder conductive particle types (Sn58Bi and SAC305) and substrate widths on the current carrying capability of FOB assembly. Stable solder joints were obtained by manipulating the curing speed of anisotropic conductive films for both particle types. Various tests were conducted, including current carrying capability assessments under differing conditions.

The study revealed that larger substrate widths yielded higher current carrying capability due to increased contact area and reduced contact resistance. Notably, solder joints remained stable beyond the solder melting temperature due to encapsulation by cured epoxy resin. SAC305 solder joints exhibited superior current carrying capability over Sn58Bi in continuous high-voltage conditions. The results emphasized the stability of SAC305 solder joints and their suitability for robust interconnections in high-power FOB assemblies.

This study contributes by offering a comprehensive assessment of the impact of solder particle types and substrate widths on solder joint performance in FOB assemblies. The finding that SAC305 joints outperform Sn58Bi under continuous high-voltage conditions adds significant value. Moreover, the observation of stable solder joints beyond solder melting temperature due to resin encapsulation introduces a novel aspect to solder joint reliability. These insights provide valuable guidance for designing robust and high-performance interconnections in demanding applications.

Heritage building management serves as a potent catalyst for sustainability, yet it poses a distinctive set of challenges. Achieving a harmonious balance between conserving the building's historical and cultural value and ensuring modern functionality and safety remains a primary concern. The present work proposes a socio-technical approach to the development and use of a digital twin (DT) that will integrate social data related to the use of heritage buildings with building and environmental data.

The paper presents a logical and systematic joined-up management framework to the targeted heritage buildings, according to a “Whole Building” approach. Our approach is informed by the underpinning assumption that a heritage building and even more a heritage neighborhood is a socio-technical, complex and dynamic system, the change of which depends on the dynamic interconnections of materials, competences, resources, values, space/environment, senses and time.

A heritage dynamics approach is adopted to unfold the dynamic nature of heritage and to better inform decisions that can be made in the present and future, achieving people-centered and place-based heritage management. This proposition underlines the heritage transformation as a complex systemic process that consists of nonlinear interconnections of multiple heterogeneous factors (values, senses, attitudes, spaces and resources).

This paper presents a multi-level framework of DTs that interact hierarchically to comprehensively understand, assimilate and seamlessly integrate intricate contexts, even when faced with conflicting conditions from diverse cultural heritage entities. This paper outlines the importance of the iterative system dynamics (SD) approach, which enables adaptive management and ensures the resilience of cultural heritage over time.