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This paper aims to use 3D laser sensors to collect high‐density data that are required for defect detection and localization at high‐production rates in manufacturing facilities.

The high‐speed sensors use Ethernet communications to transport large amounts of data and resolve any synchronization issues.

Modern laser sensor technology provides the ability to detect and quantify defects in high‐volume manufacturing, wherever defects are located. Laser line sensors provide high speed, high‐density data for full surface inspection. Synchronization and communications issues are simplified by the FireSync™ platform, making system integration straightforward, and maximizing reliability.

This paper provides detailed 3D data at high speed and uses multiple (binocular) scanners to overcome problems of occlusion.

Examines the use of laser‐induced fluorescence for the inspection of printed circuit boards. Discusses how it works, how it compares with other inspection options and what advantages it offers, particularly for the inspection of low‐contrast materials. Concludes that laser‐based automated optical inspection (AOI) has major potential advantages compared with white‐light AOI equipment.

Examines the development of a laser‐based system for detecting the presence or absence of threads on turned components used in the automotive industry. Describes how a laser inspection station would be set up to take readings from the laser detector as the component cuts a “part present” photoswitch. Explains how all the systems’ parameters are programmable by the user through a hand‐held terminal and describes two typical applications: one to detect the presence of an external thread on an engine plug and the other to check an internal thread on an aluminium insert for a fuel injection system. Outlines the properties of laser light that makes it preferable for use over camera‐based inspection systems and lists some applications suitable for laser based systems such as checking for component features such as threads, holes, grooves and tabs.

Laser‐scattering techniques have aided the correct orientation of mechanical components in automatic assembly. The same techniques can also lend themselves to certain types of inspection.

New weld inspection methods superceding visual inspection are presented. Laser‐based sensor technology contained in a handheld scanner for pre‐ and post‐weld inspection enables measurement of joint preparations or finished welds and validation of their geometry against pre‐set limits, as well as the analysis of three‐dimensional images of weld beads. The range of laser‐based sensor equipment available extends to full robotic weld inspection systems, which are applied in arc and laser welding processes on production lines, such as in the automotive industry. The benefits of these systems include higher repeatability, a permanent record for generating trending information, and the production of data helpful in reducing welding consumables used, resulting in significant savings to manufacturers.

The paper describes work relating to the laser line triangulation technique which has been used to inspect the edges of overlapping shoe components prior to the sewing operation. The laser line triangulation technique involves projecting a laser line on to a surface which can be viewed using an area camera. A surface height transition (edge) causes a discontinuity in the observed laser line. Different approaches for extracting the edge positions in the image co‐ordinate system have been investigated based on the Hough transform, the spatial histogram, polynomial regression and the discrete first derivative. These edge detection algorithms are compared in terms of speed and precision performance. Three‐dimensional scans of typical shoe component parts are presented.

This paper aims to analyze the effect of surface roughness and hardness of leadframe on the bondability of gold (Au) wedge bond using in situ inspection of laser interferometer and its relationship with the deformation and wire pull strength.

The in situ inspection of ultrasonic vibration waveform through the changes of vertical axis (y-axis) amplitude of wire bonder capillary was carried out using laser interferometer to analyze the formation of Au wedge bond. The relationship between the changes of ultrasonic waveform of capillary with the deformation and the pull strength was analyzed to evaluate the bondability of Au wedge bonds.

It was observed that the changes in vertical axis amplitude of ultrasonic vibration waveform of wire bonder capillary can be used to describe the process of bonding formation. The loss of ultrasonic energy was exhibited in ultrasonic vibration waveform of wire bonding on leadframe that has higher value of roughness (leadframe A) as compared to that of leadframe that has lower value of roughness (leadframe B). The lower pull strength obtained by Au wedge bond further confirms the reduction of bond formation because of the higher deformation on leadframe A as compared to that of leadframe B.

The relationship between in situ measurement using laser interferometer with the bondability or deformation and wire pull strength of Au wedge bonds on different surface roughness and hardness of leadframes is still lacking. These findings provide a valuable data in analyzing the bonding mechanisms that can be identified based on the in situ measurement of ultrasonic vibration and the bondability of Au wedge bonds.

As an advanced manufacturing method, additive manufacturing (AM) technology provides new possibilities for efficient production and design of parts. However, with the continuous expansion of the application of AM materials, subtractive processing has become one of the necessary steps to improve the accuracy and performance of parts. In this paper, the processing process of AM materials is discussed in depth, and the surface integrity problem caused by it is discussed.

Firstly, we listed and analyzed the characterization parameters of metal surface integrity and its influence on the performance of parts and then introduced the application of integrated processing of metal adding and subtracting materials and the influence of different processing forms on the surface integrity of parts. The surface of the trial-cut material is detected and analyzed, and the surface of the integrated processing of adding and subtracting materials is compared with that of the pure processing of reducing materials, so that the corresponding conclusions are obtained.

In this process, we also found some surface integrity problems, such as knife marks, residual stress and thermal effects. These problems may have a potential negative impact on the performance of the final parts. In processing, we can try to use other integrated processing technologies of adding and subtracting materials, try to combine various integrated processing technologies of adding and subtracting materials, or consider exploring more efficient AM technology to improve processing efficiency. We can also consider adopting production process optimization measures to reduce the processing cost of adding and subtracting materials.

With the gradual improvement of the requirements for the surface quality of parts in the production process and the in-depth implementation of sustainable manufacturing, the demand for integrated processing of metal addition and subtraction materials is likely to continue to grow in the future. By deeply understanding and studying the problems of material reduction and surface integrity of AM materials, we can better meet the challenges in the manufacturing process and improve the quality and performance of parts. This research is very important for promoting the development of manufacturing technology and achieving success in practical application.

Tape automated bonding (TAB) is one technology which is becoming widely adopted for interconnecting integrated circuits to a substrate or package. Both destructive and non‐destructive test methods for evaluation of TAB bonds are analysed and criticised. The key parameters and general guidelines of a destructive beampull test set‐up are identified and presented. The key features of four different non‐destructive test methods are described and discussed. It is found that no universal solution exists for non‐destructive evaluation of TAB bonds although some methods may be more useful than others under certain conditions and constraints. Data and experimental procedure are presented for correlation of scanning laser acoustic microscopy and beampull data.