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Article
Publication date: 13 September 2023

Bifu Xiong, Siliang He, Jinguo Ge, Quantong Li, Chuan Hu, Haidong Yan and Yu-An Shen

This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints…

Abstract

Purpose

This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints by transient liquid phase bonding (TLPB).

Design/methodology/approach

TLPB is promising to assemble die-attaching packaging for power devices. In this study, porous Cu (P-Cu) foil with a distinctive porous structure and Sn-58Bi solder (SB) serve as the bonding materials for TLPB under a formic acid atmosphere (FA). The high surface area of P-Cu enables efficient diffusion of the liquid phase of SB, stimulating the wetting, spreading and formation of intermetallic compounds (IMCs).

Findings

The higher bonding temperature decreased strength due to the coarsening of IMCs. The longer bonding time reduced the bonding strength owing to the coarsened Bi and thickened IMC. Applying optimal bonding pressure improved bonding strength, whereas excessive pressure caused damage. The presence of a Pt catalyst enhanced bonding efficiency and strength by facilitating reduction–oxidation reactions and oxide film removal.

Originality/value

Overall, this study demonstrates the feasibility of low-temperature TLPB for Cu/SB/P-Cu/SB/Cu joints and provides insights into optimizing bonding strength for the interconnecting materials in the applications of power devices.

Details

Soldering & Surface Mount Technology, vol. 36 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 31 January 2024

Tan Zhang, Zhanying Huang, Ming Lu, Jiawei Gu and Yanxue Wang

Rotating machinery is a crucial component of large equipment, and detecting faults in it accurately is critical for reliable operation. Although fault diagnosis methods based on…

Abstract

Purpose

Rotating machinery is a crucial component of large equipment, and detecting faults in it accurately is critical for reliable operation. Although fault diagnosis methods based on deep learning have been significantly developed, the existing methods model spatial and temporal features separately and then weigh them, resulting in the decoupling of spatiotemporal features.

Design/methodology/approach

The authors propose a spatiotemporal long short-term memory (ST-LSTM) method for fault diagnosis of rotating machinery. The authors collected vibration signals from real rolling bearing and gearing test rigs for verification.

Findings

Through these two experiments, the authors demonstrate that machine learning methods still have advantages on small-scale data sets, but our proposed method exhibits a significant advantage due to the simultaneous modeling of the time domain and space domain. These results indicate the potential of the interactive spatiotemporal modeling method for fault diagnosis of rotating machinery.

Originality/value

The authors propose a ST-LSTM method for fault diagnosis of rotating machinery. The authors collected vibration signals from real rolling bearing and gearing test rigs for verification.

Details

Industrial Lubrication and Tribology, vol. 76 no. 2
Type: Research Article
ISSN: 0036-8792

Keywords

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