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The purpose of this paper is to take the early Permian no.6 coal seam in Jungar coalfield of North China as an example, this paper studied the net primary productivity (NPP) level of the early Permian peatland and its relationship with the atmospheric environment at that time, analyzed the influence of the atmospheric environment, and discussed its control factors.

First, geophysical logging signals were used for a spectrum analysis to obtain the Milankovitch cycle parameters in the no. 6 coal seam, including the eccentricity (95 ka); obliquity (35.6 ka); and precession (21.2 ka). These were then used to calculate the accumulation rate of the residual carbon in the no. 6 coal seam, which was determined to be between 49.44 and 50.57 gC/(m² · a). The carbon loss could be calculated according to the density and residual carbon content of the no. 6 coal seam. Then, the total carbon accumulation rate of the peatland was further derived as being between 64.91 and 66.40 gC/(m² · a). Also, the NPP of the peatland was determined to be between 129.82 and 132.8 gC/(m² · a).

The result showed that the NPP of the early Permian peatland area was lower than that of the Holocene at the same latitude, and also lower than that of the later Permian of South China.

This study’s comprehensive analysis indicated that the temperature and humidity conditions, along with the oxygen and carbon dioxide levels in the atmosphere, were the main control factors of the NPP of the early Permian peatland. Also, wildfires were found to play a role.

The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon submount technology. As demonstrators, a smart lighting module and a sensor systems were successfully developed by using the fabrication and assembly process described in this paper.

The stacked module consists of multiple layers of silicon submounts which can be designed and fabricated in parallel. The 3D stacking design offers higher silicon efficiency and miniaturized package form factor. This platform consists of silicon submount design and fabrication, module packaging, system assembling and testing and analyzing.

In this paper, a smart light emitting diode system and sensor system will be described based on stacked silicon submount and 3D SiP technology. The integrated smart lighting module meets the optical requirements of general lighting applications. The developed SiP design is also implemented into the miniaturization of particular matter sensors and gas sensor detection system.

SiP has great potential of integrating multiple components into a single compact package, which has potential implementation in intelligent applications.

This study aims to provide a flexible and cost-effective solution of 3D heterogeneous integration for applications such as micro-electro-mechanical system (MEMS) applications and smart sensor systems.

A novel 3D system-in-package (SiP) based on stacked silicon submount technology was successfully developed and well-demonstrated by the fabrication and assembly process of a selected smart lighting module.

The stacked module consists of multiple layers of silicon submounts which can be designed and fabricated in parallel. The bonding and interconnecting process is quite simple and does not require complicated equipment. The 3D stacking design offers higher silicon efficiency and miniaturized package form factor. The submount wafer can be assembled and tested at the wafer level, thus reducing the cost and improving the yield.

The embedding design presented in this paper is applicable for modules with limited number of passives. When it comes to cases with more passive devices, new process needs to be developed to achieve fast, inexpensive and reliable assembly.

The presented 3D SiP design is novel for applications such as smart lighting, Internet of Things, MEMS systems, etc.

The purpose of this paper is to provide an overview of China's contemporary banking regulatory system, with particular focus on regulatory control of foreign banks trading in China. The paper addresses three aspects of Chinese banking regulation: what does China regulate; why does China regulate; and how does China regulate. Much of the discussion is concerned with China's regulatory agencies particularly with the role of the CBRC as the principal regulator in China's banking sector.

In the first instance the paper presents an overview of banking regulatory models gained from a review of theoretical literature in the area. Then through a wide ranging review of Chinese publications, both academic and official, the paper seeks to relate the course of regulatory reform in China, both in terms of compliance with orthodox regulatory theory, and the unique regulatory requirements of the Chinese banking system.

The paper recognises that China has embraced the need for banking regulation with the establishment of an institutional structure that is responsive to both banking supervision and government policy. Within that structure the role of the CBRC, the pervasive manner in which that agency operates, and the content of its regulatory output have been identified and critically reviewed.

In its review of the modernization of China's banking regulatory system, the paper achieves originality from the author's research into, and critical reflections on Chinese generated literature, both institutional and academic, which is then communicated in a manner that will be understood by readers familiar with Western banking regulatory theory.