Advanced
search

To read this content please select one of the options below:

System in package (SiP) technology: fundamentals, design and applications

Fabio Santagata (Dongguan Institute of Opto-Electronics, Peking University, Beijing, China and Guangdong Dongguan Quality Supervision Testing Center, Dongguan, China)
Jianwen Sun (Beijing Delft Institute of Intelligent Science and Technology, Beijing, China)
Elina Iervolino (Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen, China)
Hongyu Yu (Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen, China)
Fei Wang (Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen, China)
Guoqi Zhang (Delft Institute of Microsystems and Nanoelectronics (Dimes), Technische Universiteit Delft, Delft, The Netherlands)
P.M. Sarro (Delft Institute of Microsystems and Nanoelectronics (Dimes), Technische Universiteit Delft, Delft, The Netherlands)
Guoyi Zhang (Peking University Dongguan, Beijing, China)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 October 2018

369

Abstract

Purpose

The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon submount technology. As demonstrators, a smart lighting module and a sensor systems were successfully developed by using the fabrication and assembly process described in this paper.

Design/methodology/approach

The stacked module consists of multiple layers of silicon submounts which can be designed and fabricated in parallel. The 3D stacking design offers higher silicon efficiency and miniaturized package form factor. This platform consists of silicon submount design and fabrication, module packaging, system assembling and testing and analyzing.

Findings

In this paper, a smart light emitting diode system and sensor system will be described based on stacked silicon submount and 3D SiP technology. The integrated smart lighting module meets the optical requirements of general lighting applications. The developed SiP design is also implemented into the miniaturization of particular matter sensors and gas sensor detection system.

Originality/value

SiP has great potential of integrating multiple components into a single compact package, which has potential implementation in intelligent applications.

Keywords

Citation

Santagata, F., Sun, J., Iervolino, E., Yu, H., Wang, F., Zhang, G., Sarro, P.M. and Zhang, G. (2018), "System in package (SiP) technology: fundamentals, design and applications", Microelectronics International, Vol. 35 No. 4, pp. 231-243. https://doi.org/10.1108/MI-09-2017-0045

Publisher

:

Emerald Publishing Limited

Copyright © 2018, Emerald Publishing Limited

Related articles

Manage cookies

We’re listening — tell us what you think

Join us on our journey