Search results

The purpose of this paper is to determine the impact on brand love of consumption experience at the dimensional level and to determine whether brand love mediates between consumption experience and customer engagement in the context of Generation M.

A sample of 265 Muslim smartphone users responded to a structured questionnaire adapted from existing literature. First, confirmatory factor analysis was carried out, and then data were analyzed through structural equation modeling using MPlus.

The findings indicate that hedonic pleasure and escapism directly, while flow, challenge and learning indirectly affect brand love and that brand love mediates the relationship between consumption experience and customer engagement.

This paper explicates Generation M’s consumption experience, ascertains ways to supplement their love for brand and engage them in gainful relationships and provides suggestions for further investigation. From a managerial perspective, the paper has implications for the management of consumer experience, identifies the most valuable dimensions of consumption experience and proposes that managers can develop customer-engagement strategies via brand love.

The paper validates the mediating role of brand love in the relationship between consumption experience and customer engagement; is the first to investigate the relationship between all dimensions of consumption experience and brand love; is one of few studies to investigate consumption experience, brand love and customer engagement in developing countries; and is one of first investigations to use a sample of Generation M.

Faced with LCCC growth and their widespread acceptance for military applications, Crouzet has planned a two‐way approach for SMDs with MLTF (multilayer thick film) hybrids and advanced PWBs. This paper deals with the R&D programme carried out on both technologies. It briefly addresses MLTF interconnects under a CNES qualification programme and now being used and describes PWB R&D: first investigation and screening, optimisation programme and improvement of large advanced PWB processing. Data are given on the material analysis, TCE measurements, MLB assembly, PTH (plated‐through‐holes), solder joints and thermal analysis.

This paper addresses the various types of surface mounted packages used today for high‐density packaging of Very Large Scale Integrated devices. The paper discusses the pros and cons of both the leaded and leadless package, and provides the reader with general guidelines for their use.

One concern that has slowed the progress of surface mounted technology, in particular leadless chip carriers, has been the question of the reliability of the surface mount attachment technology. This concern follows from the realisation that the functional reliability of surface mount technology is a very complex issue involving many not very well understood components. What is needed is a relatively simple, useful, predictive model. The model reported here sidesteps the numerous complex underlying issues, which, if considered separately, make a predictive reliability model all but impossible, by taking a purely phenomenological approach and relegating second‐order effects to a lumped empirical figure of merit.

This special “Anbar Abstracts” issue of Employee Relations is split into seven sections covering abstracts under the following headings: Design of Work; Performance, Productivity and Motivation; Patterns of work; Pay, incentives and pensions; Career/manpower planning, recruitment; Industrial relations and participation; Health and safety.

The chip carrier industry and the mounting of chip carriers with solder paste are growing rapidly. Recent papers have covered the advantages of increased board density and design flexibility. This paper addresses how percent metal, paste viscosity, paste constituents, pad dimensions and spacing, print thickness, chip carrier weight, and reflow profile correlate with the incidence of undesired pad bridging and solder balls. This information can be used in circuit design and process optimisation.

This special “Anbar Abstracts” issue of the Industrial and Commercial Training is split into six sections covering abstracts under the following headings:Education/Graduates/Students; Training/Learning Techniques; Skills Training; Management Development; Career/Human Resources Development; Training Technology.

This study examined a mediating model of income and pay satisfaction with a direct path (income → pay satisfaction) and an indirect path with two mediators (income → the love of money → pay equity comparison → pay satisfaction). Results of the whole sample showed that the indirect path was significant and the direct path was insignificant. When the indirect path was eliminated, income contributed positively to pay satisfaction. We then tested the model across two moderators: culture (the United States versus Spain) and gender. This study provides the following theoretical and empirical contributions: the direct relationship between income and pay satisfaction depends on the indirect path and the extent to which (1) income enhances the love of money and (2) the love of money is applied to evaluate pay equity comparison satisfaction. If both conditions exist, income leads to pay dissatisfaction. If the second condition does not exist, income does not lead to pay dissatisfaction. Pay satisfaction depends on (1) one’s love of money and (2) how one compares. The role of the love of money in pay satisfaction is “not”universal across cultures and gender.