Parameters Affecting the Incidence of Pad Bridging in Surface Mounted Device Attachment

Abstract

The chip carrier industry and the mounting of chip carriers with solder paste are growing rapidly. Recent papers have covered the advantages of increased board density and design flexibility. This paper addresses how percent metal, paste viscosity, paste constituents, pad dimensions and spacing, print thickness, chip carrier weight, and reflow profile correlate with the incidence of undesired pad bridging and solder balls. This information can be used in circuit design and process optimisation.

Citation

Roos‐Kozel, B.L. (1985), "Parameters Affecting the Incidence of Pad Bridging in Surface Mounted Device Attachment", Microelectronics International, Vol. 2 No. 2, pp. 5-8. https://doi.org/10.1108/eb044168