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The purpose of this paper is to find an optimum between the quantity of solder paste and the desired properties of the soldered joint. A reduction of solder paste quantity is recognized as an opportunity to save money. On the other hand, the quantity of solder paste significantly influences the final properties of the soldered joint. The purpose is also to design recommendations for manufacturers of electronic assemblies.

The processing of the paper was initiated by a literature review. The expert analysis was the next step. The result of analysis was a fishbone diagram. Subsequently, the experiment was designed. Seven types and three volume of solder pastes and two aperture shapes of the stencil were used. The measured parameters were mechanical strength, electrical resistance, voids area and intermetallic compound (IMC) thicknesses. The results of the experiment were evaluated and recommendations for practice were defined.

The carried out research has confirmed the influence of solder paste quantity on the shear strength, electrical resistance, voids area and IMC thickness of solder joint. The article presents the results achieved for solders Sn42Bi58, Sn42Bi57.6Ag0.4, SnAg3.0Cu0.5, SnCu0.7Ag1.0NiGe, SnAg3.5Bi0.5In8.0 and Sn62.5Pb36.5Ag1.0. Reduction of solder paste quantity down to 74 per cent (i.e. one quarter of quantity) decreases mechanical shear strength less than 10 per cent. Recommendations relating to the optimal reduction of solder paste quantity have been designed for each solder paste.

Contribution of the paper is impact assessment of solder paste quantity on the properties of the soldered joint. It was carried out a large number of experiments and measurements which verify this effect. Such a comprehensive overview of the results is not yet available in the literature. Recommendations for manufacturers of electronic assemblies are also the benefit of article.

The purpose of this paper is to verify how solder joint properties correlate with soldering profile set-up. These characteristics act against each other. All observed properties may significantly affect the quality and reliability of solder joints. The purpose is also to design recommendations for manufacturers of electronic assemblies.

The samples for experiment were reflowed by using a laboratory reflow oven. A LEXT laser confocal microscope was used for wetting angle and intermetallic compound (IMC) thickness measurement. The ionic contamination was measured by using a contaminometer.

The appropriate choice of soldering profile is very important for the reliability of electronic assemblies. The higher temperatures or longer preheating and soldering times improve the wetting angle. Likewise, there is also the activation of all the fluxes. The result is low contamination with printed circuit boards (PCBs). On the other hand, we must not forget that higher temperatures and longer soldering time also affect the thickness of the IMC. The outer limits recommended by the manufacturer were selected for the soldering profile set-up. Even within these limits, it is possible to achieve an improvement in the wetting angle, an improvement in levels of PCB contamination and an increase in the thickness of the IMC. This paper presents the results achieved for solders Sn42Bi57.6Ag0.4, Sn96.5Ag3Cu0.5 and Sn97Ag3.

The gained knowledge on the correlation between IMC thickness, solderability of PCB and PCB contamination caused by different soldering profile set-ups can help to prevent reliability problems because each of the named effects has a significant influence on reliability.

This paper examines issues that focus on the importance of accounting data generated knowledge information and its role in modern business. The cognitive aspect of this research reflects the ability of companies and its employees to apply knowledge for managerial purposes using accounting data.

Using a questionnaire, a five-factor model related to information communication, information cognitive utilization, functional optimization, applicability and cognitive efficiency was created.

Findings present a series of complex correlations highlighting possible actions to utilize knowledge as a tool for management. Information is obtained regarding the management of knowledge and the adoption of information systems.

The results reflect the limited implementation of intellectual capital practices and understanding of knowledge as a financial tool for executives and employees. Based on the above, an attempt was made to formulate the questions for the careful identification of the factors.

Rapid developments in information and communication technologies, together with a realization that knowledge is a resource of general and cost strategic importance, changed the operational structures of companies, shifting value from materials to intangible assets. This paper demonstrates how multiple variables are correlated and how small changes could help increase intellectual capital and facilitate the construction of knowledge based systems.

The need for an accounting valuation of intellectual capital in order to present the true picture of business value is evident. This paper illustrates factors such as interactive communication and systematic cognitive efficiency or the monetization of information as a preliminary step for future valuation and management intellectual capital models.

Direct access to sufficient and reliable information, lead to the search for effective tools for the creation, aggregation and exchange of knowledge. The latter becomes a key goal for information systems. Emphasis is placed on the benefits and critical success factors of knowledge management systems, as essential information systems to support and enhance organizational processes.