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The aims of this paper is to study the effects of the V/III ratio of indium gallium nitride (InGaN) quantum wells (QWs) on the structural, optical and electrical properties of near-ultraviolet light-emitting diode (NUV-LED).

InGaN-based NUV-LED is successfully grown on the c-plane patterned sapphire substrate at atmospheric pressure using metal organic chemical vapor deposition.

The indium composition and thickness of InGaN QWs increased as the V/III ratio increased from 20871 to 11824, according to high-resolution X-ray diffraction. The V/III ratio was also found to have an important effect on the surface morphology of the InGaN QWs and thus the surface morphology of the subsequent layers. Apart from that, the electroluminescence measurement revealed that the V/III ratio had a major impact on the light output power (LOP) and the emission peak wavelength of the NUV-LED. The LOP increased by up to 53% at 100 mA, and the emission peak wavelength of the NUV-LED changed to a longer wavelength as the V/III ratio decreased from 20871 to 11824.

This study discovered a relation between the V/III ratio and the properties of QWs, which resulted in the LOP enhancement of the NUV-LED. High TMIn flow rates, which produced a low V/III ratio, contribute to the increased LOP of NUV-LED.

The purpose of this paper is to enhance the efficiency of the LED by introducing three-step magnesium (Mg) doping profile. Attention was paid to the effects of the Mg doping concentration of the first p-GaN layer (i.e. layer close to the active region). Attention was paid to the effects of the Mg doping concentration of the first p-GaN layer (i.e. layer close to the active region).

Indium gallium nitride (InGaN)–based light-emitting diode (LED) was grown on a 4-inch c-plane patterned sapphire substrate using metal organic chemical vapor deposition. The Cp₂Mg flow rates for the second and third p-GaN layers were set at 50 sccm and 325 sccm, respectively. For the first p-GaN layer, the Cp₂Mg flow rate varied from 150 sccm to 300 sccm to achieve different Mg dopant concentrations.

The full width at half maximum (FWHM) for the GaN (102) plane increases with increasing Cp₂Mg flow rate. FWHM for the sample with 150, 250 and 300 sccm Cp₂Mg flow rates was 233 arcsec, 236 arcsec and 245 arcsec, respectively. This result indicates that the edge and mixed dislocations in the p-GaN layer were increased with increasing Cp₂Mg flow rate. Atomic force microscopy (AFM) results reveal that the sample grown with 300 sccm exhibits the highest surface roughness, followed by 150 sccm and 250 sccm. The surface roughness of these samples is 2.40 nm, 2.12 nm and 2.08 nm, respectively. Simultaneously, the photoluminescence (PL) spectrum of the 250 sccm sample shows the highest band edge intensity over the yellow band ratio compared to that of other samples. The light output power measurements found that the sample with 250 sccm exhibits high output power because of sufficient hole injection toward the active region.

Through this study, the three steps of the Mg profile on the p-GaN layer were proposed to show high-efficiency InGaN-based LED. The optimal Mg concentration was studied on the first p-GaN layer (i.e. layer close to active region) to improve the LED performance by varying the Cp₂Mg flow rate. This finding was in line with the result of PL and AFM results when the samples with 250 sccm have the highest Mg acceptor and good surface quality of the p-GaN layer. It can be deduced that the first p-GaN layer doping has a significant effect on the crystalline quality, surface roughness and light emission properties of the LED epi structure.

This study aims to focus on roughening N-face (backside) GaN substrate prior to GaN-on-GaN light-emitting diode (LED) growth as an attempt to improve the LED performance.

The N-face of GaN substrate was roughened by three different etchants; ammonium hydroxide (NH4OH), a mixture of NH₄OH and H₂O₂ (NH₄OH: H₂O₂) and potassium hydroxide (KOH). Hexagonal pyramids were successfully formed on the surface when the substrate was subjected to the etching in all cases.

Under 30 min of etching, the highest density of pyramids was obtained by NH4OH: H₂O₂ etching, which was 5 × 10⁹ cm^–2. The density by KOH and NH₄OH etchings was 3.6 × 10⁹ and 5 × 10⁸ cm^–2, respectively. At standard operation of current density at 20 A/cm², the optical power and external quantum efficiency of the LED on the roughened GaN substrate by NH₄OH: H₂O₂ were 12.3 mW and 22%, respectively, which are higher than its counterparts.

This study demonstrated NH₄OH: H₂O₂ is a new etchant for roughening the N-face GaN substrate. The results showed that such etchant increased the density of the pyramids on the N-face GaN substrate, which subsequently resulted in higher optical power and external quantum efficiency to the LED as compared to KOH and NH₄OH.