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The purpose of this paper is to study the screen surface parameters of the double deck vibrating screen, in sections, to determine the influence of each part of the screen surface on the screening efficiency of the vibrating screen. Finally, the best screening parameters were calculated to obtain the best screening performance.

In this paper, the discrete element method is used to simulate the process of two-layer subsection screening. Response surface test was used to analyze the influence of various factors and their interactions on screening results. Finally, based on the binomial regression model of screening efficiency, the optimal combination of vibration parameters is calculated.

In the screening process of vibrating screen, due to the different screening environments in each area of the screen surface, the single-layer linear vibrating screen with equal screen surface parameters cannot obtain the best screening performance. Among the single factors, the effect of vibration frequency is the most significant.

To address the issue of single layer linear vibrating screens with equal screen surface parameters being unable to maintain optimal screening performance when handling large amounts of materials. This article proposes a double layer vibrating screen with different screen surface grids and screen surface angles to address the problem of low screening performance of traditional single layer linear vibrating screens.

IT IS AN AXIOM that engineers never stop learning. Every fresh job is a fresh challenge that must be met and overcome.

This review paper aims to provide a better understanding of formulation and processing of anisotropic conductive adhesive film (ACF) material and to summarize the significant research and development work for the mechanical properties of ACF material and joints, which helps to the development and application of ACF joints with better reliability in microelectronic packaging systems.

The ACF material was cured at high temperature of 190°C, and the cured ACF was tested by conducting the tensile experiments with uniaxial and cyclic loads. The ACF joint was obtained with process of pre-bonding and final bonding. The impact tests and shear tests of ACF joints were completed with different aging conditions such as high temperature, thermal cycling and hygrothermal aging.

The cured ACF exhibited unique time-, temperature- and loading rate-dependent behaviors and a strong memory of loading history. Prior stress cycling with higher mean stress or stress amplitude restrained the ratcheting strain in subsequent cycling with lower mean stress or stress amplitude. The impact strength and adhesive strength of ACF joints increased with increase of bonding temperature, but they decreased with increase of environment temperature. The adhesive strength and life of ACF joints decreased with hygrothermal aging, whereas increased firstly and then decreased with thermal cycling.

This study is to review the recent investigations on the mechanical properties of ACF material and joints in microelectronic packaging applications.