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This study aims to apply an electrochemical grinding (ECG) technology to improve the material removal rate (MRR) under the premise of certain surface roughness in machining U71Mn alloy.

The effects of machining parameters (electrolyte type, grinding wheel granularity, applied voltage, grinding wheel speed and machining time) on the MRR and surface roughness are investigated with experiments.

The experiment results show that an electroplated diamond grinding wheel of 46# and 15 Wt.% NaNO₃ + 10 Wt.% NaCl electrolyte is more suitable to be applied in U71Mn ECG. And the MRR and surface roughness are affected by machining parameters such as applied voltage, grinding wheel speed and machining time. In addition, the maximum MRR of 0.194 g/min is obtained with the 15 Wt.% NaCl electrolyte, 17 V applied voltage, 1,500 rpm grinding wheel speed and 60 s machining time. The minimum surface roughness of Ra 0.312 µm is obtained by the 15 Wt.% NaNO₃ + 10 Wt.% NaCl electrolyte, 13 V applied voltage, 2,000 rpm grinding wheel speed and 60 s machining time.

Under the electrolyte scouring effect, the products and the heat generated in the machining can be better discharged. ECG has the potential to improve MRR and reduce surface roughness in machining U71Mn.

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-10-2023-0341/

This paper aims to present the fabrication of 6061 aluminum alloy (AA6061) using a promising laser additive manufacturing process, called the laser-foil-printing (LFP) process. The process window of AA6061 in LFP was established to optimize process parameters for the fabrication of high strength, dense and crack-free parts even though AA6061 is challenging for laser additive manufacturing processes due to hot-cracking issues.

The multilayers AA6061 parts were fabricated by LFP to characterize for cracks and porosity. Mechanical properties of the LFP-fabricated AA6061 parts were tested using Vicker’s microhardness and tensile testes. The electron backscattered diffraction (EBSD) technique was used to reveal the grain structure and preferred orientation of AA6061 parts.

The crack-free AA6061 parts with a high relative density of 99.8% were successfully fabricated using the optimal process parameters in LFP. The LFP-fabricated parts exhibited exceptional tensile strength and comparable ductility compared to AA6061 samples fabricated by conventional laser powder bed fusion (LPBF) processes. The EBSD result shows the formation of cracks was correlated with the cooling rate of the melt pool as cracks tended to develop within finer grain structures, which were formed in a shorter solidification time and higher cooling rate.

This study presents the pioneering achievement of fabricating crack-free AA6061 parts using LFP without the necessity of preheating the substrate or mixing nanoparticles into the melt pool during the laser melting. The study includes a comprehensive examination of both the mechanical properties and grain structures, with comparisons made to parts produced through the traditional LPBF method.

This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint.

The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3.

A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.