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Today modern epoxy base materials for printed circuit board production are designed with properties which ensure high dimensional stability, resistance to chemical action, and increased glass transition temperature, in order to meet the stringent demands now encountered in electronics use. Polyfunctional epoxy resins and the appropriate hardener/accelerator compositions are in widespread, effective use in the design of superior laminates. The quality of the through‐hole plating for holes drilled in these improved materials will depend on various parameters, including those covered by three main complexes: base material, mechanical processing, and chemical processes used for treatment of the drilled hole. Special attention is paid in this paper to the resin recession phenomenon in terms of processing parameters.

The fifth in the series of Printed Circuit World Conventions is being held in Glasgow, Scotland, from 12—15 June 1990. It is organised by the UK Printed Circuit World Convention Committee under the direction of the co‐sponsors: EIPC (Europe), IMF (UK), IPC (USA), JPCA (Japan) and PCIF (UK).

This paper reports on a method for in‐situ observation of the morphology and stability of electrochemically generated metal layers. This information is obtained by comparing topographical and kinetic data. The method is based on coulometric, microgravimetric and optical measurement performed in situ on vertically growing electrodes. Measurements are obtained simultaneously from the same surface area.