Morphology and Stability of Electrochemically Generated Copper Layers: The Effect of Electron Transfer and Nucleation Kinetics

M. Wünsche (Atotech Deutschland GmbH,Berlin, Germany)
H. Meyer (Atotech Deutschland GmbH,Berlin, Germany)
R. Schumacher (Atotech Deutschland GmbH,Berlin, Germany)

Circuit World

ISSN: 0305-6120

Publication date: 1 December 1996

Abstract

This paper reports on a method for in‐situ observation of the morphology and stability of electrochemically generated metal layers. This information is obtained by comparing topographical and kinetic data. The method is based on coulometric, microgravimetric and optical measurement performed in situ on vertically growing electrodes. Measurements are obtained simultaneously from the same surface area.

Keywords

Citation

Wünsche, M., Meyer, H. and Schumacher, R. (1996), "Morphology and Stability of Electrochemically Generated Copper Layers: The Effect of Electron Transfer and Nucleation Kinetics", Circuit World, Vol. 22 No. 3, pp. 4-9. https://doi.org/10.1108/03056129610800036

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MCB UP Ltd

Copyright © 1996, MCB UP Limited

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