This paper reports on a method for in‐situ observation of the morphology and stability of electrochemically generated metal layers. This information is obtained by comparing topographical and kinetic data. The method is based on coulometric, microgravimetric and optical measurement performed in situ on vertically growing electrodes. Measurements are obtained simultaneously from the same surface area.
Wünsche, M., Meyer, H. and Schumacher, R. (1996), "Morphology and Stability of Electrochemically Generated Copper Layers: The Effect of Electron Transfer and Nucleation Kinetics", Circuit World, Vol. 22 No. 3, pp. 4-9. https://doi.org/10.1108/03056129610800036Download as .RIS
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