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The key environmental issue of the 1980s has been that of the depletion of the stratospheric ozone. The key environmental issue to be addressed in the 1990s will be that of global warming. These head the list of worldwide ecological problems that arise directly from the activities of man. Each industrial sector has an urgent responsibility to increase awareness of such problems within both management and production and to seek to alleviate its impact upon the environment through development of modified or alternative manufacturing technologies. The electronics assembly sector had the opportunity to consider its future in a more environmentally conscious world at the first conference on Electronics Manufacturing and the Environment. This two‐day event was held at the Bournemouth International Centre. It was organised by Vertical Marketing of Wimborne and sponsored by The Department of Trade and Industry, Du Pont, ICI and Multicore Solders, who must take credit for a well organised and splendidly presented conference. The theme of the conference was one particular implication of environmental awareness, namely the elimination of chlorofluorocarbons (CFCs) as a goal of the electronics manufacturing industry. The conference was aimed at addressing ways in which companies can eliminate the use of CFCs, taking into account the moral and financial implications involved as well as the stringent restrictions in CFC production that are about to be imposed.

The purpose of this paper is to identify, study and quantify the effects of lighting on yield and productivity in manual electronics assembly (MEA) and inspection as a limiting work design criterion. The study also examines the potential interactions among lighting option, workers' age, and years of experience.

A three‐factor full factorial experiment is adopted to statistically evaluate the independent variables (process yield and assembly time) versus randomly selected levels of three factors: type of light (low pressure sodium, mercury vapor lamps, and metal halide lamps measured in foot‐candle luminaries), operator age, and years on the job. A residual analysis is also conducted to complement and corroborate the ANOVA findings.

The study finds that metal halide lamps, based on the ANSI recommended ranges of 186‐464 foot‐candles, lead to significant increases in labor productivity and through‐put, irrespective of operators' age and years of experience. Although these lamps have a significantly shorter life span than that of low‐pressure sodium and mercury vapor lamps, the realized benefits far exceed the incremental cost of illumination devices. The results indicate that a modest capital investment is able to generate solid improvements in yield and processing time in a typical MEA environment.

The relations between productivity and lighting intensity and type have never been studied in the area of MEA. This empirical study uncovers the effects through a systematic experimentation of this essential relationship in a typical MEA environment. The findings, which can be generalized to other facilities, are validated by an array of statistical procedures and proved to be significant. The paper contributes useful knowledge to the fields of engineering management and facility design.

There are both “Swedish” and “Japanese” models for the organization of final assembly. Discusses the theoretical and historical background to these models and the main practical differences between them. Provides an empirical study based on action research conducted in the final assembly area of a Scottish electronics company. The aims of the research were to effect change in the company by applying just‐in‐time (JIT) assembly methods, and to observe the process of change and the consequences for production of the cellular approach to assembly and the formation of assembly teams. Two projects were undertaken. In the first, a JIT cell was built for the assembly of a new product; this cell and an existing, conventional flowline operated in parallel for a period. In the second, a work team was formed, consisting of the operators assembling an older product on a machine‐paced line; the members of this team were given a significantly higher level of work autonomy than before. Provides a detailed account of the two projects.

In electronics assembly, the losses of electronic components throughout the surface‐mounting process (including kitting and setup) are hard to trace. This affects accurate material planning and manufacturing costing. This paper aims to investigate this issue and to generate a suitable mixture of strategies for the relevant causes.

The project is executed by an undergraduate manufacturing engineering student and several company engineers over a period of ten weeks. Define, measure, analyze, improve, and control (DMAIC) approach delineates the project stages. The solutions devised must be in agreement with lean philosophies and practices currently upheld in the company.

Component losses stem from multiple sources and are complicated by inherent information inaccuracies. A right mixture of strategies is envisaged on analysis on these sources. An average 18 percent of decrement in component losses in monetary value is achieved in the initial 16 weeks of the improvement phase.

The DMAIC approach induces a focused, systematic and thorough study on the selected area. For the limitations, this study is based on a single industrial case. The evidence may be anecdotal and idiosyncratic to the electronics assembly industry. The final solutions which emerged need to factor in the organization current maturities in Lean and Six Sigma concepts.

Component loss is a common problem faced by electronics assembly industries. In this paper, the nature of the problem and the related investigation are extensively illustrated in the context of the case study. As many electronics assembly industries have embarked on Lean or Lean Six Sigma journeys, the savings and data accuracy improvement achieved in this case study provide valuable benchmarks.

The issues related to electronic component losses have not been reported in established literature to date. This is also the first reported success case study of applying DMAIC to address these issues in a lean company.

The flux residues on almost all soldered printed circuit boards are removed using the chlorofluorocarbon (CFC) 113. In just one year's time production of this solvent will almost certainly be curtailed, on a scale agreed internationally. This is a major issue that needs to be addressed urgently by the electronics assembly industry worldwide. This paper presents (i) the background that has led to the restrictions being placed on production and consumption of solvent 113, (ii) the international agreement and timetable for the implementation of the restrictions and (iii) the perceived opportunities that are available to the electronics assembly industry to meet this challenge.

In the electronics industry of the Federal Republic of Germany 286,000 employees are working in assembly twice as many as in the automotive or machine building industries.

This conference, in the series being run by the National Physical Laboratory to help the electronics assembly industry consider the problems of CFC phase‐out, was essentially an updated repeat of the event held on 30 April, which had been a complete, standing‐room‐only sell‐out. Surprisingly, this repeat performance also attracted a full house and the format used has proved to be the most popular of all the NPL non‐CFC options conferences.

The first results from two collaborative UK programmes assessing the performance of non‐CFC cleaning options for the electronics assembly industry were presented at a one‐day conference on 6 February at the Heathrow Forte Crest Hotel. This was the latest of the long series of meetings on the CFC issue organised by the National Physical Laboratory.

The demise of the CFC‐113/alcohol azeotropic solvent for de‐fluxing circuit assemblies after soldering has led, in recent years, to the electronics assembly industry being offered other cleaning technologies, some new and some new to this industry. In terms of uptake, one of the most successful will be semi‐aqueous cleaning involving the use of an organic solvent of low volatility to dissolve the contamination followed by an aqueous rinsing process. Two families of solvent have evolved based on natural products (terpenes) and synthetic hydrocarbon chemicals. This paper reviews the possible semi‐aqueous processes and the development of the solvents that has taken place. The cleaning performance is considered as well as the potential for effluent control and fully closed‐loop systems.