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The purpose of the paper is to show up the current possibilities by combination of classic thick-film technology with advanced processing. Thick-film hybrid ceramic substrates have been a base for highly reliable devices for space, aerospace, medical and industrial applications since many years. The combination of classic thick-film printing with advanced technologies for fine line structuring provides substrates best suited for packaging solutions with challenging requirements, such as temperature stability and extended product lifetime. Combined with state of the art assembly technologies, thick-film substrates are used in highly demanding industries.

In recent years, several technologies for fine line structuring have been introduced, e.g. fine line printing, photo imaging, etching, laser structuring for local chip fan-out or fine line structuring on single layers. For further miniaturization of thick-film multilayers circuits, after solving the fine line resolution, the reduction of electrical connection of conductive layers through printed insulation/dielectric layer (via) diameters to connect the layers should be addressed.

The focus of this paper is to show the results of combining fine line structuring with laser microvias and to compare laser drilling in thick-films with different established via forming technologies.

The reduction of via size to 60 µm – smaller than 50% compared to using state-of-the-art printing technologies enables a solution for significant relaxation of current design possibilities.

Cities are host to many of the world’s knowledge intensive research and innovation clusters. As such, they are likely to be attractive locations for emerging market multinational enterprises (MNEs) seeking to engage in knowledge seeking “springboard” type firm-level catch-up strategies. The purpose of this study is to therefore explore whether city-based research-intensive clusters containing deep pools of location bounded (i.e. “sticky”) knowledge are a stronger driver for greenfield research and development (R&D)-related FDI projects for Chinese MNEs than they are for developed market MNEs.

The authors use logistic modelling on 97,163 worldwide greenfield FDI projects to explore the relative likelihoods of Chinese MNEs engaging in R&D-related greenfield (i.e. “strategic asset seeking”) FDI projects as well as how city type (global or research-intensive cluster city) moderates this relationship for Chinese MNEs.

The authors find that Chinese MNEs are more likely to engage in overseas R&D FDI projects (compared with other types of project) than DMNEs and that research-intensive city clusters hold a stronger attraction for Chinese MNEs than developed market MNEs.

The authors discuss how the research contributes to the debate on emerging market MNE catch-up theory, as well as that on sub-national city location choice, by highlighting the growing importance of sub-national geography to understanding strategic asset seeking related greenfield FDI.

Sub-national city location choice is an important driver of strategic asset seeking FDI for Chinese MNEs, one that both national and local city level policymakers should pay attention to.

Chinese FDI via aggressive mergers and acquisitions to acquire key technologies has been restricted in recent years. Policymakers must consider whether they may also wish to restrict Chinese greenfield FDI in R&D-related projects, which now exhibit a pronounced upward trend.

The authors highlight the growing importance of sub-national geography to understanding strategic asset seeking related greenfield FDI in Chinese MNEs (and how it plays, more generally, a central role in their strategies).