Multilayer thick-film ceramic for multichip modules with laser microvias
Article publication date: 2 July 2018
The purpose of the paper is to show up the current possibilities by combination of classic thick-film technology with advanced processing. Thick-film hybrid ceramic substrates have been a base for highly reliable devices for space, aerospace, medical and industrial applications since many years. The combination of classic thick-film printing with advanced technologies for fine line structuring provides substrates best suited for packaging solutions with challenging requirements, such as temperature stability and extended product lifetime. Combined with state of the art assembly technologies, thick-film substrates are used in highly demanding industries.
In recent years, several technologies for fine line structuring have been introduced, e.g. fine line printing, photo imaging, etching, laser structuring for local chip fan-out or fine line structuring on single layers. For further miniaturization of thick-film multilayers circuits, after solving the fine line resolution, the reduction of electrical connection of conductive layers through printed insulation/dielectric layer (via) diameters to connect the layers should be addressed.
The focus of this paper is to show the results of combining fine line structuring with laser microvias and to compare laser drilling in thick-films with different established via forming technologies.
The reduction of via size to 60 µm – smaller than 50% compared to using state-of-the-art printing technologies enables a solution for significant relaxation of current design possibilities.
The authors would like to thank all the colleagues who did the trials in production, HTW and TU-Dresden, especially institutes IAVT and IHM for their good educational work – and supporting us with analytical methods. And the thick-film ink manufacturers, who are now and hopefully in future supporting the high end of the technology with competent technical support and reliable material portfolio.
Löffler, S., Mauermann, C., Rebs, A. and Reppe, G. (2018), "Multilayer thick-film ceramic for multichip modules with laser microvias", Microelectronics International, Vol. 35 No. 3, pp. 158-163. https://doi.org/10.1108/MI-11-2017-0065
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