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The ballooning health misinformation on social media raises grave concerns. Drawing upon the S-O-R (Stimulus-Organism-Response) model and the information processing literature, this study aims to explore (1) how social media health information seeking (S) affects health misinformation sharing intention (R) through the channel of health misperceptions (O) and (2) whether the mediation process would be contingent upon different information processing predispositions.

Data were collected from a survey comprising 388 respondents from the Chinese middle-aged or above group, one of China's most susceptible populations to health misinformation. Standard multiple linear regression models and the PROCESS Macro were adopted to examine the direct effect and the moderated mediation model.

Results bolstered the S-O-R-based mechanism, in which health misperceptions mediated social media health information seeking's effect on health misinformation sharing intention. As an indicator of analytical information processing, need for cognition (NFC) failed to moderate the mediation process. Contrarily, faith in intuition (FI), an indicator reflecting intuitive information processing, served as a significant moderator. The positive association between social media health information seeking and misperceptions was stronger among respondents with low FI.

This study sheds light on health misinformation sharing research by bridging health information seeking, information internalization and information sharing. Moreover, the authors extended the S-O-R model by integrating information processing predispositions, which differs this study from previous literature and advances the extant understanding of how information processing styles work in the face of online health misinformation. The particular age group and the Chinese context further inform context-specific implications regarding online health misinformation regulation.

The peer review history for this article is available at: https://publons.com/publon/10.1108/OIR-04-2023-0157.

This study aims to investigate the wetting behavior of AgCuTi and AgCu filler metals on selective laser melting (SLMed) Ti/TiB₂, and to analyze the microstructure and fracture characteristics of SLMed Ti/TiB₂/AgCuTi or AgCu alloy/SLMed Ti/TiB₂ brazed joints. The wetting behavior of AgCuTi and AgCu filler metals on the selective laser melted (SLMed) Ti/TiB₂ has been studied. The analysis of microstructures and fracture characteristics in vacuum-brazed SLMed Ti/TiB₂ substrate, using AgCuTi and AgCu filler metals, has been conducted to elucidate the influence of brazing temperature and alloy composition on the shear strength of the brazed joints.

Brazing SLMed-Ti/TiB₂ in a vacuum using AgCuTi and AgCu filler metals, this study aims to explore the optimal parameters for brazed joints at various brazing temperatures (800°C−950°C).

The findings suggest that elevated brazing temperatures lead to a more extensive diffusion region in the joint as a result of the partial melting of the filler metal. The joint composition changes from distinct Ti₂Cu layer/TiCu layer/filler metal to a-Ti (ss) + ß-Ti (ss)/TiCu. As the brazing temperature increases, the fracture mode shifts from brittle cleavage to ductile fracture, mainly attributed to a decrease in the CuTi within the brazed joint. This change in fracture behavior indicates an improvement in the ductility and toughness of the joint.

The originality of this study lies in the comprehensive analysis of the microstructure and shear strength of vacuum brazing SLMed Ti/TiB₂ using AgCuTi and AgCu filler metals.

Exploratory search activities are ubiquitous in various information systems. Much potentially useful or even serendipitous information is discovered during the exploratory search process. Given its irreplaceable role in information systems, exploratory search has attracted growing attention from the information system community. Since few studies have methodically reviewed current publications, researchers and practitioners are unable to take full advantage of existing achievements, which, in turn, limits their progress in this field. Through a literature review, this study aims to recapitulate important research topics of exploratory search in information systems, providing a research landscape of exploratory search.

Automatic and manual searches were performed on seven reputable databases to collect relevant literature published between January 2005 and July 2023. The literature pool contains 146 primary studies on exploratory search in information system research.

This study recapitulated five important topics of exploratory search, namely, conceptual frameworks, theoretical frameworks, influencing factors, design features and evaluation metrics. Moreover, this review revealed research gaps in current studies and proposed a knowledge framework and a research agenda for future studies.

This study has important implications for beginners to quickly get a snapshot of exploratory search studies, for researchers to re-align current research or discover new interesting issues, and for practitioners to design information systems that support exploratory search.

This paper aims to focus on the reliability of Sn15Bi–xAg and Sn15Bi–xCu solder joints during isothermal aging.

The effects of Ag or Cu additions on the microstructure, interfacial metallic compound layer and shear strength of Sn–15Bi (Sn15Bi) based solder joints during were investigated. The effects of Ag or Cu additions on the microstructure and tensile properties of Sn15Bi-based bulk solders were also investigated to provide a comprehensive analysis. The interfacial morphology and microstructure were observed by scanning electron microscopy and the composition in the structure was examined by energy dispersive spectrometer. The shear tests were carried out on the as-soldered and as-aged joints using a ball shear tester.

The results revealed that by adding Ag or Cu, the microstructure of Sn15Bi solder can be refined. Ag addition increased the tensile strength of Sn15Bi solder but had little effect on elongation. However, Cu addition decreased the tensile strength and elongation of Sn15Bi solder. For solder joints, Ag addition increased the shear strength and toughness of Sn15Bi/Cu joints but Cu addition decreased the shear strength and toughness of Sn15Bi/Cu joints.

The authors can potentially provide a replacement for Sn40Pb traditional solder with Sn15Bi solder by alloying Ag or Cu due to its lower cost and similar melting point as Sn–Pb solder.