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The impact of rolling on the performance of micro arc oxidation (MAO) coatings on ZM5 alloy has been underreported. The purpose of this study is to explore the correlation between rolling and the failure mechanism of MAO coatings in greater depth.

The influence of rolling on the corrosion and wear properties of MAO coating was investigated by phase structure, bond strength test (initial bond strength and wet adhesion), electrochemical impedance spectroscopy and wear test. The change of the surface electrochemical properties was studied by first principles analysis.

The results showed that the MAO coating on rolled alloy had better corrosion and wear resistance compared to cast alloy, although the structure and component content of two kinds of MAO coating are nearly identical. The difference in interface bonding between MAO coating and Mg substrate is the primary factor contributing to the disparity in performance between the two types of samples. Finally, the impact of the rolling process on MAO coating properties is explained through first-principle calculation.

A comprehensive explanation of the impact of the rolling process on MAO coating properties will provide substantial support for enhancing the application of Mg alloy anticorrosion.

This paper aims to concentrate on recent innovations in flexible wearable sensor technology tailored for monitoring vital signals within the contexts of wearable sensors and systems developed specifically for monitoring health and fitness metrics.

In recent decades, wearable sensors for monitoring vital signals in sports and health have advanced greatly. Vital signals include electrocardiogram, electroencephalogram, electromyography, inertial data, body motions, cardiac rate and bodily fluids like blood and sweating, making them a good choice for sensing devices.

This report reviewed reputable journal articles on wearable sensors for vital signal monitoring, focusing on multimode and integrated multi-dimensional capabilities like structure, accuracy and nature of the devices, which may offer a more versatile and comprehensive solution.

The paper provides essential information on the present obstacles and challenges in this domain and provide a glimpse into the future directions of wearable sensors for the detection of these crucial signals. Importantly, it is evident that the integration of modern fabricating techniques, stretchable electronic devices, the Internet of Things and the application of artificial intelligence algorithms has significantly improved the capacity to efficiently monitor and leverage these signals for human health monitoring, including disease prediction.

At the moment, in terms of both research and commercial products, smart shoe technology and applications seem not to attract the same magnitude of attention compared to smart garments and other smart wearables such as wrist watches and wrist bands. The purpose of this study is to fill this knowledge gap by discussing issues regarding smart shoe sensing technologies, smart shoe sensor placements, factors that affect sensor placements and finally the areas of smart shoe applications.

Through a review of relevant literature, this study first and foremost attempts to explain what constitutes a smart shoe and subsequently discusses the current trends in smart shoe applications. Discussed in this study are relevant sensing technologies, sensor placement and areas of smart shoe applications.

This study outlined 13 important areas of smart shoe applications. It also uncovered that majority of smart shoe functionality are physical activity tracking, health rehabilitation and ambulation assistance for the blind. Also highlighted in this review are some of the bottlenecks of smart shoe development.

To the best of the authors’ knowledge, this is the first comprehensive review paper focused on smart shoe applications, and therefore serves as an apt reference for researchers within the field of smart footwear.

Au stud bump bonding technology is an effective means to realize heterogeneous integration of commercial chips in the 2.5D electronic packaging. The purpose of this paper is to study the long-term reliability of the Au stud bump treated by four different high temperature storage times (200°C for 0, 100, 200 and 300 h).

The bonding strength and the fracture behavior are investigated by chip shear test. The experiment is further studied by microstructural characterization approaches such as scanning electron microscope, energy dispersive spectrometer and so on.

It is recognized that there were mainly three typical fracture models during the chip shear test among all the Au stud bump samples treated by high temperature storage. For solder bump before aging, the fracture occurred at the interface between the Cu pad and the Au stud bump. As the aging time increased, the fracture mainly occurred inside the Au stud bump at 200°C for 100 and 200 h. When aging time increased to 300 h, it is found that the fracture transferred to the interface between the Au stud bump and the Al Pad.

In addition, the bonding strength also changed with the high temperature storage time increasing. The bonding strength does not change linearly with the high temperature storage time increasing but decreases first and then increases. The investigation shows that the formation of the intermetallic compounds because of the reaction between the Au and Al atoms plays a key role on the bonding strength and fracture behavior variation.