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This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties (>5 MPa shear strength) and low thermal interface resistance (better than for SAC solders) are the goal of this research.

Mechanical and thermal properties of TIM joints between gold plated contacts of chip and substrate were investigated. Sintering technique based on Ag pastes was applied for purpose of this study. Performance properties were assessed by shear force tests and thermal measurements. Scanning electron microscopy was used for microstructural observations of cross-section of formed joints.

It was concluded that the best properties are achieved for pastes containing spherical Ag particles of dozens of micrometer size with flake shaped Ag particles of few micrometers size. Sintering temperature at 230°C and application of 1 MPa force on the chip during sintering gave the higher adhesion and the lowest thermal interface resistance.

The new material based on Ag paste containing mixtures of Ag particles of different size (form nanometer to dozens of microns) and shape (spherical, flake) suspended in resin was proposed. Joints prepared using sintering technique and Ag pastes at 230°C with applied pressure shows better mechanical and thermal than other TIM materials such as thermal grease, thermal gel or thermally conductive adhesive. Those material could enable electronic device operation at temperatures above 200°C, currently unavailable for Si-based power electronics.

This paper is supposed to provide a critical review of current research progress on thermal management in grinding of superalloys, and future directions and challenges. By understanding the current progress and identifying the developing directions, thermal management can be achieved in the grinding of superalloys to significantly improve the grinding quality and efficiency.

The relevant literature is collected from Web of Science, Scopus, CNKI, Google scholar, etc. A total of 185 literature is analyzed, and the findings in the literature are systematically summarized. In this case, the current development and future trends of thermal management in grinding of superalloys can be concluded.

The recent developments in grinding superalloys, demands, challenges and solutions are analyzed. The theoretical basis of thermal management in grinding, the grinding heat partition analysis, is also summarized. The novel methods and technologies for thermal management are developed and reviewed, i.e. new grinding technologies and parameter optimization, super abrasive grinding wheel technologies, improved lubrication, highly efficient coolant delivery and enhanced heat transfer by passive thermal devices. Finally, the future trends and challenges are identified.

Superalloys have excellent physical and mechanical properties, e.g. high thermal stability, and good high-temperature strength. The superalloys have been broadly applied in the aerospace, energy and automobile industries. Grinding is one of the most important precision machining technologies for superalloy parts. Owing to the mechanical and physical properties of superalloys, during grinding processes, forces are large and a massive heat is generated. Consequently, the improvement of grinding quality and efficiency is limited. It is important to conduct thermal management in the grinding of superalloys to decrease grinding forces and heat generation. The grinding heat is also dissipated in time by enhanced heat transfer methods. Therefore, it is necessary and valuable to holistically review the current situation of thermal management in grinding of superalloys and also provide the development trends and challenges.