Table of contents
The Impact of Boundary‐scan on Surface Mount Technology in Design, Manufacturing and System Test
R. Adams, P. Spitz, W. VaheyWith the emergence of surface mount technology and, more recently, advances in packaging technologies (i.e., ball grid arrays), test continues to be a complex, time‐consuming…
Feasibility Study of OSEE Inspection for Flux Residue on Electronics Assemblies
C.S. WelchThe technique of Optically Stimulated Electron Emission (OSEE) is considered as a method of inspecting printed circuit based electronics assemblies for flux residue immediately…
Assembly with Conductive Adhesives
K. GilleoThe electronics assembly industry has fortunately rediscovered conductive adhesives as the search for lead‐free joining materials and improved performance intensifies. Although…
Reduced Oxide Soldering Activation (ROSA™) Production Compatibility Evaluation
D.M. Tench, D.P. Anderson, P. Jambazian, P. Kim, J. White, D. Hillman, D. Frommelt, G.K. Lucey, T. Gher, B. PiekarskiThe recently developed Reduced Oxide Soldering Activation (ROSA™) method is shown to be compatible with long‐term use with mass soldering processes. Prototype regeneration cells…
Procedures for Metallographic Examination and Mechanical Strength Testing of Fine Pitch Surface Mount IC Package Solder Joints
T. Yamada, R. Doyle, J. BarrettThe reduction in IC package lead pitches in surface mount solder assembly and the current high emphasis on quality and reliability of printed circuit assemblies have created a…
How Much Rework Is Too Much?: The Effects of Solder Joint Rework on Plated‐through Holes in Multilayer Printed Wiring Boards
A. Garrison, M. Lee, H.S. Park, N.L. ToddIn the assembly process of high reliability printed wiring boards (PWBs), rework cycles seem to be an unfortunate fact of life. The question repeatedly arises as to how many times…
SMART news
The SMART European Conference from 16–17 November, 1994 was a resounding success with over 300 delegales attending over the two days of the event. The SMART mix of high technical…

ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang