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Reduced Oxide Soldering Activation (ROSA™) Production Compatibility Evaluation

D.M. Tench (Rockwell International Science Center, Thousand Oaks, California, USA)
D.P. Anderson (Rockwell International Science Center, Thousand Oaks, California, USA)
P. Jambazian (Rockwell International Science Center, Thousand Oaks, California, USA)
P. Kim (Rockwell International Science Center, Thousand Oaks, California, USA)
J. White (Rockwell International Science Center, Thousand Oaks, California, USA)
D. Hillman (Collins Avionics and Communications Division, Rockwell International, Cedar Rapids, Iowa, USA)
D. Frommelt (Collins Avionics and Communications Division, Rockwell International, Cedar Rapids, Iowa, USA)
G.K. Lucey (Army Research Laboratories, Adelphi, Maryland, USA)
T. Gher (Army Research Laboratories, Adelphi, Maryland, USA)
B. Piekarski (Army Research Laboratories, Adelphi, Maryland, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 January 1995

43

Abstract

The recently developed Reduced Oxide Soldering Activation (ROSA™) method is shown to be compatible with long‐term use with mass soldering processes. Prototype regeneration cells operated for as long as six months with minimal maintenance retained their effectiveness for providing short wetting times under a variety of perturbations. The operating window for the process is wide and component degradation caused by exposure to the fully charged solution is minimal. The ROSA treatment provides soldering performance comparable to that attainable with a fully activated rosin flux and offers the promise of providing low soldering defect rates without the use of CFC solvents.

Citation

Tench, D.M., Anderson, D.P., Jambazian, P., Kim, P., White, J., Hillman, D., Frommelt, D., Lucey, G.K., Gher, T. and Piekarski, B. (1995), "Reduced Oxide Soldering Activation (ROSA™) Production Compatibility Evaluation", Soldering & Surface Mount Technology, Vol. 7 No. 1, pp. 18-25. https://doi.org/10.1108/eb037886

Publisher

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MCB UP Ltd

Copyright © 1995, MCB UP Limited

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