Circuit World: Volume 38 Issue 4


Table of contents

Integrated MEMS in package

Mark Bachman, G.P. Li

The purpose of this paper is to present the utilities of packaging and PCB fabrication processes for manufacturing micro electromechanical systems (MEMS) and its package for…

Inkjet printing of conductive materials: a review

Gerard Cummins, Marc P.Y. Desmulliez

The purpose of this paper is to present an exhaustive review of research studies and activities in the inkjet printing of conductive materials.


A novel flip‐chip interconnection process for integrated circuits

Mark W. Sugden, David A. Hutt, David C. Whalley, Changqing Liu

The purpose of this paper is to present an outline of the development of a new process for the formation of flip‐chip interconnections using metal coated polymer microparticles.

The influence of test method, conductor profile and substrate anisotropy on the permittivity values required for accurate modeling of high frequency planar circuits

Allen F. Horn, Patricia A. LaFrance, John W. Reynolds, John Coonrod

The purpose of this paper is to help high frequency circuit designers understand how to choose the best permittivity value for a laminate material for accurate modeling.

SCB and SMI: two stretchable circuit technologies, based on standard printed circuit board processes

Jan Vanfleteren, Thomas Loeher, Mario Gonzalez, Frederick Bossuyt, Thomas Vervust, Ingrid De Wolf, Michal Jablonski

In the past 15 years stretchable electronic circuits have emerged as a new technology in the domain of assembly, interconnections and sensor circuits and assembly technologies. In…

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  • Associate Professor Pooya Davari