Table of contents
Catalytic anodes for electrodeposition: a study for acid copper printed circuit board (PCB) production
D.R. Gabe, A.J. CobleyInsoluble anodes have long been used as an alternative to the preferred soluble types, primarily for their practicality and without great attention to their efficacy. However…
A variant of conductive filament formation failures in PWBs with 3 and 4 mil spacings
Keith L. Rogers, Michael G. PechtTo show how the use of conductor spacings below 4 mil in printed wiring boards (PWBs) can introduce an unanticipated failure mechanism, leading to current leakage and short…
Conductive anodic filament (CAF) formation: an historic perspective
Laura J. TurbiniConductive anodic filament (CAF) is a failure mode in printed wiring boards (PWBS), which occurs under high humility and high voltage gradient conditions. This paper aims to…
Tin whisker risk assessment
Tong Fang, Michael Osterman, Sony Mathew, Michael PechtTo present a methodology, including the algorithms, to quantify the risk of failure from tin whiskers and to present a dynamic risk trend based on the distribution of each of the…
Experiences with peel strength
Rudolf WiechmannPeel strength numbers are part of a laminate's specifications and should characterize the specific bond performance (copper adhesion) under test conditions. Unfortunately, from…
Making printed circuit boards (PCBs) using an LPKF plotter
D.F. He, H. ItozakiTo present the steps for creating printed circuit boards (PCBs) using Protel and an LPKF plotter.
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari