Nihon Superior introduces SN100C (551CT)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 3 February 2012

332

Citation

(2012), "Nihon Superior introduces SN100C (551CT)", Soldering & Surface Mount Technology, Vol. 24 No. 1. https://doi.org/10.1108/ssmt.2012.21924aaa.024

Publisher

:

Emerald Group Publishing Limited

Copyright © 2012, Emerald Group Publishing Limited


Nihon Superior introduces SN100C (551CT)

Article Type: New products From: Soldering & Surface Mount Technology, Volume 24, Issue 1

Nihon Superior Co. Ltd has introduced SN100C (551CT) (Figure 5), the newest addition to its SN100C lead-free solder series.

SN100C (551CT) fluxed-cored solder wire combines the benefits of a eutectic lead-free alloy with a robust, high-temperature capable cored flux for high-speed sequential soldering. The cored flux is formulated for high soldering tip temperatures up to 380°C with good tip separation for reduced icicles. The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term as well as impact strains to which a solder joint can be subjected.

 Figure 5 SN100C (551CT)

Figure 5 SN100C (551CT)

SN100C (551CT) is designed for high-speed robotic soldering processes and the excellent wetting and high spread factor offers increased soldering speeds with hand soldering as well. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305. About 12 years after its introduction, the SN100C lead-free alloy continues to displace SAC305 in many applications due to its high reliability, low copper erosion and cost effectiveness.

For more information, visit web site: www.nihonsuperior.co.jp

Related articles