Rehm Thermal Systems introduced CondensoX Soldering System

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 20 September 2011

Citation

(2011), "Rehm Thermal Systems introduced CondensoX Soldering System", Soldering & Surface Mount Technology, Vol. 23 No. 4. https://doi.org/10.1108/ssmt.2011.21923daa.011

Publisher

:

Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited


Rehm Thermal Systems introduced CondensoX Soldering System

Article Type: New products From: Soldering & Surface Mount Technology, Volume 23, Issue 4

Rehm Thermal Systems has introduced their CondensoX Soldering System, which allows users to adapt vapour phase soldering to manufacturing conditions. Utilising a variety of handling variants, the unique system ensures that void-free soldering can be achieved in virtually any SMD manufacturing system.

Able to be implemented into existing SMD lines, the CondensoX series from Rehm is an advanced condensation reflow soldering system designed to meet the challenges of lead-free solder alloys for small and high-thermal mass PCBs. The CondensoX series is based on a sophisticated design featuring a hermetically-locked vacuum chamber. Without moving the assembly during the soldering process, the CondensoX combines vacuum profiling and thermal profiling in one machine.

By enabling the operator to solder variable-sized components with small delta Ts even in the pre-heating zone, CondensoX overcomes the limitations of conventional vapour phase machines. Moreover, the unique system can also rise to the challenges of soldering in different height levels up to 100 mm. CondensoX can also lower the boiling point of the media to accommodate lead and lead-free profiles in a single system. Avoiding any movement to the assembly during the soldering process, the system eliminates the risk of component movement. Lack of movement and enhanced thermal control lowers scrap rates and improves cost of ownership!

With CondensoX, the vacuum can be applied directly and without delay at the point where the required temperature is reached. High responsiveness is further reinforced by the inherent flexibility offered by the system’s variety of loading options. Manual, automatic, and high-speed loading configurations are available for manufacturers to choose from. The CondensoXP HS features two carriers that work synchronously inside the system, cutting cycle time by almost 50 percent. Furthermore, the flexibility of the system enables the customer to adapt it to required workflow, meaning that flow direction is not compromised as it typically is on classical inline systems. The machine can be scaled up from a basic to a high-speed system, without compromising the process or requiring further investment. Only the handling is adapted to meet new requirements.