Rehm Thermal Systems signs distribution agreement with ENCON in Poland

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 18 September 2009

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Citation

(2009), "Rehm Thermal Systems signs distribution agreement with ENCON in Poland", Soldering & Surface Mount Technology, Vol. 21 No. 4. https://doi.org/10.1108/ssmt.2009.21921dab.003

Publisher

:

Emerald Group Publishing Limited

Copyright © 2009, Emerald Group Publishing Limited


Rehm Thermal Systems signs distribution agreement with ENCON in Poland

Article Type: Industry news From: Soldering & Surface Mount Technology, Volume 21, Issue 4

Rehm Thermal Systems continued their global expansion program with the announcement of a new partnership agreement. ENCON will now handle the distribution of Rehm’s diverse line of soldering products in Poland.

Andreas Brockt VP Sales Europe for Rehm Thermal Systems commented, “This is a strategically important step for our global distribution structure. The management and staff at ENCON have deep, established relationships with these markets and their business model aligns closely with that of Rehm Thermal Systems. This is the perfect time to add a proven, value-add support organization as we introduce numerous new leading edge products to the market place. Rehm Thermal Systems historically has been a technologically strong company and to have a partner with such skills provides a great foundation for a strong future.”

For further information, please visit the web site: www.maszynysmt.pl

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