Cookson move manufacture to Hungary

Citation

(2008), "Cookson move manufacture to Hungary", Soldering & Surface Mount Technology, Vol. 20 No. 4. https://doi.org/10.1108/ssmt.2008.21920dab.005

Cookson move manufacture to Hungary

Article Type: Industry news From: Soldering & Surface Mount Technology, Volume 20, Issue 4

Cookson Electronics Assembly Materials is to relocate its manufacturing facilities nearer to the markets that they serve. The movement of high-volume electronics assembly operations to regions of Central Europe has been underway for several years, and is the motivation behind the Company’s change to its business plan.

Cookson intends to transfer European manufacturing to its sites in Continental Europe and the former Eastern Bloc over the next two years. Solder paste manufacture will be transferred to a new centre of excellence in Dunaharaszti (near Budapest, Hungary).

Focusing European production at this one site will enable the company to employ the very latest bulk manufacturing techniques to minimise batch to batch inconsistency in such a critical product line. Chemical and flux production will transfer to s-Hertogenbosch in the Netherlands.

The move will see the closure of the Company’s Ashford manufacturing site in early 2010 when the current lease expires.

For further information, please visit the web site: www.cooksonelectronics.com