Award-winning ProFlow® technology from DEK evolves to broaden capability and expand process window

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 27 June 2008

Citation

(2008), "Award-winning ProFlow® technology from DEK evolves to broaden capability and expand process window", Soldering & Surface Mount Technology, Vol. 20 No. 3. https://doi.org/10.1108/ssmt.2008.21920cad.008

Publisher

:

Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited


Award-winning ProFlow® technology from DEK evolves to broaden capability and expand process window

Award-winning ProFlow® technology from DEK evolves to broaden capability and expand process window

Article Type: New products From: Soldering & Surface Mount Technology, Volume 20, Issue 3

Since it’s introduction to the electronics industry over ten years ago, DEK’s ProFlow® enclosed head printing system has won numerous awards and effectively enabled many advances in materials deposition applications around the globe. Now, as ProFlow moves into its second decade, the technology has been further developed to deliver an expanded process window and even broader capabilities.

The inherent benefits of ProFlow enclosed head printing include exceptionally efficient materials transfer, superior throughput rates, higher process yields, lower material consumption and improved process control. Because the material is contained in a sealed environment, as opposed to being exposed to air as in traditional squeegee applications, enclosed head printing affords the environmental and cost saving benefits of lower material waste. Building on the foundation of existing ProFlow engineering, DEK technical specialists have now extended the system’s capabilities to deliver efficiencies for a wide variety of applications including traditional solder paste printing, flux deposition, adhesives and encapsulant printing, solder spheres, thermal interface materials, biomedical formulations and more.

The extended competence of ProFlow now incorporates the ability to mix and condition materials and delivers uniform performance control. By independently creating a body of conditioned material at the stencil interface, the performance of processes such as pin-in-paste are also dramatically improved. Other alterations include the use of industry standard materials syringe packaging, a modified chamber design to simplify cleaning and direct material loading capability.

Part of DEK’s suite of Productivity Tools, ProFlow is unequivocally the world’s most successful enclosed printing technology. Now, with the ability to extend its exceptional performance capabilities to even more applications, ProFlow is poised to raise the bar yet again on materials deposition technology.

For more information on DEK’s ProFlow Technology, log onto: www.dek.com