Kent Ang to lead DEK's electroform and platinum stencil production in Asia

Citation

(2008), "Kent Ang to lead DEK's electroform and platinum stencil production in Asia", Soldering & Surface Mount Technology, Vol. 20 No. 2. https://doi.org/10.1108/ssmt.2008.21920bab.008

Kent Ang to lead DEK's electroform and platinum stencil production in Asia

Article Type: Appointments From: Soldering & Surface Mount Technology

DEK's has appointed a new process manufacturing engineer to further enhance its stencil production for customers. Kent Ang, an accomplished stencil specialist, has been promoted from Electroform Process Engineer to take on the new role in the company's Asia Pacific division. With immediate effect, he will oversee production for both the Electroform and Platinum stencils developed and engineered by the company.

As the new process manufacturing engineer position encompasses two stencil technologies electroform and platinum Ang's responsibilities include operational control and direction of both production teams on a day-to-day basis. He will continue to work on improvements to the electroform processes but pursue specific objectives that focus on the development of stand off materials for ball placement stencils. Ang's unique engineering expertise will also be utilised on DEK's platinum stencil production.

Speaking about the promotion, Kelvin Lai, Operations and Project Manager at DEK says: “Kent's appointment is hugely significant to both external and internal customers. We will deploy his specialist skill-set to deliver an even higher level of quality, support and engineering development for both Electroform and Platinum stencils. With his achievements well documented within DEK most notably acclaimed work that improved the quality, stability and standardisation of the electroform process Kent is the ideal person to develop these processes further in 2008. We can definitely expect more from Kent in his new post and are confident that his skills will strengthen DEK's position further within the stencils market, as well as impact positively on product improvement and customer satisfaction,” adds Lai.

Ang joined DEK in June 2006 where, as an Electroform Process Engineer, he was involved in several high-profile developments to the stencil process. Most notably his R&D work improved the mandrel base and ball placement, both of which significantly enhanced the stencil's quality and stability.

Commenting on his promotion, Ang says: “I am delighted to be taking on the new role of Process Manufacturing Engineer and working with our customers to drive developments in stencil technology. This position is very exciting as I will be involved with DEK's latest and most advanced stencil processes. I'm confident that 2008 will prove to be an extremely productive year for DEK's stencil technology, benefiting our customers around the world.”

DEK's groundbreaking work on electroform and platinum stencils sets the company's technologies and engineering expertise apart from its competitors. The electroform process ensures ultimate control over stencil thickness and uniformity, delivering outstanding paste volume consistency for fine pitch applications. In addition, the company's platinum process delivers exceptional and repeatable precision, representing a breakthrough for new generation packaging such as wafer-bumping applications.