Keywords
Citation
(2005), "DEK Galaxy wins coveted AP award", Soldering & Surface Mount Technology, Vol. 17 No. 4. https://doi.org/10.1108/ssmt.2005.21917dab.002
Publisher
:Emerald Group Publishing Limited
Copyright © 2005, Emerald Group Publishing Limited
DEK Galaxy wins coveted AP award
DEK Galaxy wins coveted AP award
Keywords: Quality awards, Electronics industry
In a ceremony at Semicon West exhibition in San Francisco, California, DEK's Galaxy high accuracy mass imaging platform was awarded with Advanced Packaging magazine's prestigious AP Award. The win again confirms DEK's next-generation packaging leadership and the high accuracy processing capabilities of the Galaxy platform.
DEK's unique Galaxy system combines several new technologies that enable high accuracy mass imaging for a variety of final manufacturing packaging applications, from wafer-level up to and including encapsulation and solder ball attach. Galaxy addresses the ever present need for resource maximisation, as it can be configured and easily re-deployed to host a number of different packaging processes including wafer bumping, ball placement, singulation, thermal interface material (TIM) deposition and backside wafer coating. The system is compatible with industry-standard handling formats such as FOUPS or Auer boards, plus wafer chucks and DEK's virtual panel tooling (VPT).